发明申请
US20050196888A1 Method of crystallizing a nitride III-V compound semiconductor layer on a sapphire substrate
有权
在蓝宝石衬底上结晶氮化物III-V化合物半导体层的方法
- 专利标题: Method of crystallizing a nitride III-V compound semiconductor layer on a sapphire substrate
- 专利标题(中): 在蓝宝石衬底上结晶氮化物III-V化合物半导体层的方法
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申请号: US11113597申请日: 2005-04-25
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公开(公告)号: US20050196888A1公开(公告)日: 2005-09-08
- 发明人: Etsuo Morita
- 申请人: Etsuo Morita
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 优先权: JPP10-180930 19980626
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/205 ; H01L21/335 ; H01L33/00 ; H01L33/12 ; H01L33/16 ; H01L33/20 ; H01L33/32 ; H01S5/00 ; H01S5/02 ; H01S5/323 ; H01S5/343 ; H01L21/00 ; H01L21/46
摘要:
To improve crystallographic property of a nitride III-V compound semiconductor layer grown on a sapphire substrate, a plurality of recesses are made on a major surface of the sapphire substrate, and the nitride III-V compound semiconductor layer is grown thereon. At least a part of the inner surface of each recess makes an angle not less than 10 degrees with respect to the major surface of the sapphire substrate. The recesses are buried with nitride III-V compound semiconductor crystal having a higher Al composition ratio than the nitride III-V compound semiconductor layer, such as AlxGa1-xN crystal whose Al composition ratio x is 0.2 or more, for example. Each recess has a depth not less than 25 nm and a width not less than 30 nm. The recesses may be made either upon thermal cleaning of the sapphire substrate or by using lithography and etching, thermal etching, or the like.
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