发明申请
- 专利标题： Flexible substrate having interlaminar junctions, and process for producing the same
- 专利标题（中）： 具有层间结合的柔性基板及其制造方法
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申请号： US11079371申请日： 2005-03-15
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公开(公告)号： US20050205291A1公开(公告)日： 2005-09-22
- 发明人: Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
- 申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
- 优先权： JPP2004-079848 20040319; JPP2004-088853 20040325; JPP2004-088854 20040325; JPP2004-318887 20041102; JPP2004-318888 20041102
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H05K1/00 ; H05K1/11 ; H05K3/10 ; H05K3/20 ; H05K3/38 ; H05K3/40 ; H05K3/46
摘要：
A process for producing a flexible substrate comprising of a film, an insulating resin layer, and a wiring pattern, said process comprising the steps of: (a) preparing a sheet member comprising, (i) the film, (ii) the insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face, and (iii) a front-sided wiring pattern embedded in said insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (b) pressing a part of at least one of said front-sided wiring pattern and said rear-sided wiring pattern into the inside of said sheet member so that a part of said front-sided wiring pattern and a part of said rear-sided wiring pattern are jointed to each other to form a junction.
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