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1.发明授权Flexible substrate having interlaminar junctions, and process for producing the same 有权具有层间结合的柔性基板及其制造方法公开(公告)号：US07531754B2
公开(公告)日：2009-05-12
申请号：US11712943
申请日：2007-03-02
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
IPC分类号： H05K1/00
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.
摘要翻译： 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。
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2.发明授权Flexible substrate having interlaminar junctions, and process for producing the same 有权具有层间结合的柔性基板及其制造方法公开(公告)号：US07205483B2
公开(公告)日：2007-04-17
申请号：US11079371
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
IPC分类号： H05K1/11
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.
摘要翻译： 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。
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公开(公告)号：US20070151756A1
公开(公告)日：2007-07-05
申请号：US11712943
申请日：2007-03-02
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
IPC分类号： H05K1/16
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.
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4.发明申请Flexible substrate having interlaminar junctions, and process for producing the same 有权具有层间结合的柔性基板及其制造方法公开(公告)号：US20050205291A1
公开(公告)日：2005-09-22
申请号：US11079371
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A process for producing a flexible substrate comprising of a film, an insulating resin layer, and a wiring pattern, said process comprising the steps of: (a) preparing a sheet member comprising, (i) the film, (ii) the insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face, and (iii) a front-sided wiring pattern embedded in said insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (b) pressing a part of at least one of said front-sided wiring pattern and said rear-sided wiring pattern into the inside of said sheet member so that a part of said front-sided wiring pattern and a part of said rear-sided wiring pattern are jointed to each other to form a junction.
摘要翻译： 一种制造柔性基材的方法，包括膜，绝缘树脂层和布线图案，所述方法包括以下步骤：（a）制备片状部件，其包括：（i）膜，（ii）绝缘树脂 所述膜的前表面上形成的层和所述膜的与所述前表面相对的背面，以及（iii）嵌入在所述绝缘树脂层的所述前表面上形成的所述绝缘树脂层中的前侧布线图案 膜和嵌入在形成在所述膜的所述背面上的绝缘树脂层中的背面布线图案; 和（b）将所述前侧布线图案和所述背面布线图案中的至少一个的一部分压入所述片状构件的内部，使得所述前侧布线图案的一部分和所述背面布线图案的一部分， 双面布线图案彼此连接以形成结。
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公开(公告)号：US07773386B2
公开(公告)日：2010-08-10
申请号：US11976848
申请日：2007-10-29
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
IPC分类号： H05K1/00
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.
摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。
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6.发明申请Flexible substrate, multilayer flexible substrate and process for producing the same 有权柔性基板，多层柔性基板及其制造方法公开(公告)号：US20080210458A1
公开(公告)日：2008-09-04
申请号：US11976848
申请日：2007-10-29
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
IPC分类号： H05K1/03
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate comprises: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.
摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。
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7.发明授权Flexible substrate, multilayer flexible substrate and process for producing the same 有权柔性基板，多层柔性基板及其制造方法公开(公告)号：US07321496B2
公开(公告)日：2008-01-22
申请号：US11079316
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.
摘要翻译： 柔性基板包括：膜; 形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; 嵌入到形成在膜的前表面上的绝缘树脂层中的前侧布线图案和嵌入在形成在膜的背面上的绝缘树脂层中的背面布线图案; 以及位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个正面上的绝缘树脂层 薄膜的表面和背面比薄膜厚。
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8.发明申请Flexible substrate, Multilayer flexible substrate and process for producing the same 有权柔性基板，多层柔性基板及其制造方法公开(公告)号：US20050205294A1
公开(公告)日：2005-09-22
申请号：US11079316
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate comprising: (i) a film; (ii) an insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (iv) a via which is located between a front-sided wiring pattern and a rear-sided wiring pattern and serves to electrically connect between said front-sided wiring pattern and said rear-sided wiring pattern; wherein said insulating resin layer formed on each of said front face and said rear face of the said film is thicker than said film.
摘要翻译： 一种柔性基板，包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的与所述前表面相对的表面的每一个上的绝缘树脂层; （iii）嵌入在所述膜的所述前表面上形成的绝缘树脂层中的前侧布线图案和嵌入在所述膜的所述背面上形成的绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于电连接在所述前侧布线图案和所述背面布线图案之间; 其中形成在所述膜的所述前表面和所述后表面的每一个上的所述绝缘树脂层比所述膜厚。
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9.发明授权Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei 有权使用导电颗粒作为核的倒装芯片安装工艺和凸块形成工艺公开(公告)号：US07726545B2
公开(公告)日：2010-06-01
申请号：US11886311
申请日：2006-03-13
申请人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
发明人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
CPC分类号： H05K3/3436 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/11524 , H01L2224/16 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/83886 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , Y10T29/49126 , H01L2224/13099 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.
摘要翻译： 根据本发明的倒装芯片安装工艺或凸块形成工艺的特征在于，导电颗粒固定在形成在电子部件上的电极上。 将包含焊料粉末，对流添加剂和树脂组分的组合物供应到电子部件的表面上，该表面设置有电极。 将所提供的组合物加热到使焊料粉末熔化的温度。 结果，对流添加剂沸腾或分解以产生气体。 所产生的气体在所提供的组合物内产生对流现象。 由于对流现象促使焊料粉末的移动，焊料粉末可以在组合物内自由移动。 导电颗粒用作焊料粉末的自组装和生长的核。 结果，允许熔融焊料粉末在导电颗粒附近自组装和生长，这导致连接或凸块的形成。
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10.发明申请Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles 有权使用导电颗粒的翻转夹安装工艺和凸起成型工艺公开(公告)号：US20080165518A1
公开(公告)日：2008-07-10
申请号：US11886311
申请日：2006-03-13
申请人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
发明人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
IPC分类号： H01L23/498 , H05K3/36 , B23K1/20 , H01L21/60
CPC分类号： H05K3/3436 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/11524 , H01L2224/16 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/83886 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , Y10T29/49126 , H01L2224/13099 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.
摘要翻译： 根据本发明的倒装芯片安装工艺或凸块形成工艺的特征在于，导电颗粒固定在形成在电子部件上的电极上。 将包含焊料粉末，对流添加剂和树脂组分的组合物供应到电子部件的表面上，该表面设置有电极。 将所提供的组合物加热到使焊料粉末熔化的温度。 结果，对流添加剂沸腾或分解以产生气体。 所产生的气体在所提供的组合物内产生对流现象。 由于对流现象促使焊料粉末的移动，焊料粉末可以在组合物内自由移动。 导电颗粒用作焊料粉末的自组装和生长的核。 结果，允许熔融焊料粉末在导电颗粒附近自组装和生长，这导致连接或凸块的形成。
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