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1.发明授权Flexible substrate having interlaminar junctions, and process for producing the same 有权具有层间结合的柔性基板及其制造方法公开(公告)号：US07531754B2
公开(公告)日：2009-05-12
申请号：US11712943
申请日：2007-03-02
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
IPC分类号： H05K1/00
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.
摘要翻译： 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。
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公开(公告)号：US20070151756A1
公开(公告)日：2007-07-05
申请号：US11712943
申请日：2007-03-02
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
IPC分类号： H05K1/16
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.
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3.发明授权Flexible substrate having interlaminar junctions, and process for producing the same 有权具有层间结合的柔性基板及其制造方法公开(公告)号：US07205483B2
公开(公告)日：2007-04-17
申请号：US11079371
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
IPC分类号： H05K1/11
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.
摘要翻译： 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。
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4.发明申请Flexible substrate having interlaminar junctions, and process for producing the same 有权具有层间结合的柔性基板及其制造方法公开(公告)号：US20050205291A1
公开(公告)日：2005-09-22
申请号：US11079371
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
发明人： Yoshihisa Yamashita , Hiroki Yabe , Takashi Ichiryu , Seiichi Nakatani , Satoru Tomekawa , Toshio Fujii , Seiji Karashima
CPC分类号： H05K3/4084 , G03G15/225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0393 , H05K3/102 , H05K3/1266 , H05K3/20 , H05K3/207 , H05K3/386 , H05K3/4652 , H05K2201/0376 , H05K2203/0143 , H05K2203/0195 , H05K2203/0517 , H05K2203/1189 , H05K2203/1572 , H01L2924/00
摘要： A process for producing a flexible substrate comprising of a film, an insulating resin layer, and a wiring pattern, said process comprising the steps of: (a) preparing a sheet member comprising, (i) the film, (ii) the insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face, and (iii) a front-sided wiring pattern embedded in said insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (b) pressing a part of at least one of said front-sided wiring pattern and said rear-sided wiring pattern into the inside of said sheet member so that a part of said front-sided wiring pattern and a part of said rear-sided wiring pattern are jointed to each other to form a junction.
摘要翻译： 一种制造柔性基材的方法，包括膜，绝缘树脂层和布线图案，所述方法包括以下步骤：（a）制备片状部件，其包括：（i）膜，（ii）绝缘树脂 所述膜的前表面上形成的层和所述膜的与所述前表面相对的背面，以及（iii）嵌入在所述绝缘树脂层的所述前表面上形成的所述绝缘树脂层中的前侧布线图案 膜和嵌入在形成在所述膜的所述背面上的绝缘树脂层中的背面布线图案; 和（b）将所述前侧布线图案和所述背面布线图案中的至少一个的一部分压入所述片状构件的内部，使得所述前侧布线图案的一部分和所述背面布线图案的一部分， 双面布线图案彼此连接以形成结。
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5.发明申请Flexible substrate, multilayer flexible substrate and process for producing the same 有权柔性基板，多层柔性基板及其制造方法公开(公告)号：US20080210458A1
公开(公告)日：2008-09-04
申请号：US11976848
申请日：2007-10-29
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
IPC分类号： H05K1/03
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate comprises: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.
摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。
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公开(公告)号：US07773386B2
公开(公告)日：2010-08-10
申请号：US11976848
申请日：2007-10-29
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
IPC分类号： H05K1/00
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.
摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。
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7.发明授权Flexible substrate, multilayer flexible substrate and process for producing the same 有权柔性基板，多层柔性基板及其制造方法公开(公告)号：US07321496B2
公开(公告)日：2008-01-22
申请号：US11079316
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.
摘要翻译： 柔性基板包括：膜; 形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; 嵌入到形成在膜的前表面上的绝缘树脂层中的前侧布线图案和嵌入在形成在膜的背面上的绝缘树脂层中的背面布线图案; 以及位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个正面上的绝缘树脂层 薄膜的表面和背面比薄膜厚。
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8.发明申请Flexible substrate, Multilayer flexible substrate and process for producing the same 有权柔性基板，多层柔性基板及其制造方法公开(公告)号：US20050205294A1
公开(公告)日：2005-09-22
申请号：US11079316
申请日：2005-03-15
申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
发明人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
CPC分类号： H05K3/386 , H01L51/424 , H01L2924/0002 , H05K1/16 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K2201/0191 , H05K2201/0376 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A flexible substrate comprising: (i) a film; (ii) an insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (iv) a via which is located between a front-sided wiring pattern and a rear-sided wiring pattern and serves to electrically connect between said front-sided wiring pattern and said rear-sided wiring pattern; wherein said insulating resin layer formed on each of said front face and said rear face of the said film is thicker than said film.
摘要翻译： 一种柔性基板，包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的与所述前表面相对的表面的每一个上的绝缘树脂层; （iii）嵌入在所述膜的所述前表面上形成的绝缘树脂层中的前侧布线图案和嵌入在所述膜的所述背面上形成的绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于电连接在所述前侧布线图案和所述背面布线图案之间; 其中形成在所述膜的所述前表面和所述后表面的每一个上的所述绝缘树脂层比所述膜厚。
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公开(公告)号：US08283246B2
公开(公告)日：2012-10-09
申请号：US13091801
申请日：2011-04-21
IPC分类号： H01L21/00
CPC分类号： H01L24/16 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13022 , H01L2224/13099 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/29299 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83885 , H01L2224/83886 , H01L2224/83887 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0264 , H05K2203/087 , H05K2203/1178 , Y02P70/613 , H01L2924/01031 , H01L2924/01049 , H01L2924/01051 , H01L2924/01083 , H01L2924/00011 , H01L2924/00015 , H01L2924/066 , H01L2924/06 , H01L2924/0675 , H01L2924/0695 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The invention involves mounting a solder resin composition (6) including a solder powder (5a) and a resin (4) on the first electronic component (2); arranging such that the connecting terminals (3) of the first electronic component (2) and the electrode terminals (7) of the second electronic component (8) are facing each other; ejecting a gas (9a) from a gas generation source (1) included in the first electronic component (2) by heating the first electronic component (2) and the solder resin composition; and inducing the flow of the solder powder (5a) in the solder resin composition (6) by inducing convection of the gas (9a) in the solder resin composition (6), and electrically connecting the connecting terminals (3) and the electrode terminals (7) by self-assembly on the connecting terminals (3) and the electrode terminals (7). Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.
摘要翻译： 本发明涉及将包含焊料粉末（5a）和树脂（4）的焊料树脂组合物（6）安装在第一电子部件（2）上; 排列成使得第一电子部件（2）的连接端子（3）和第二电子部件（8）的电极端子（7）彼此面对; 通过加热第一电子部件（2）和焊料树脂组合物，从包括在第一电子部件（2）中的气体发生源（1）喷出气体（9a） 并且通过引起焊料树脂组合物（6）中的气体（9a）的对流而引起焊料粉末（5a）在焊料树脂组合物（6）中的流动，并将连接端子（3）和电极端子 （7）通过在连接端子（3）和电极端子（7）上的自组装。 通过这种方式提供了一种倒装芯片封装方法，其以高连接可靠性连接具有窄间距的半导体芯片的电极端子和电路板的连接端子，以及用于封装在电路板上的凸块形成方法。
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10.发明申请FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CHIP MOUNTING BODY 有权浮动芯片安装方法，浮动芯片安装装置和浮动芯片安装体公开(公告)号：US20090203170A1
公开(公告)日：2009-08-13
申请号：US11914416
申请日：2006-03-30
CPC分类号： H01L21/563 , H01L21/67103 , H01L21/67126 , H01L23/3135 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75743 , H01L2224/81121 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/8192 , H01L2224/83102 , H01L2224/83104 , H01L2224/83886 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01027 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/381 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0126 , H05K2203/082 , Y02P70/613 , Y10T29/53183 , H01L2924/00 , H01L2924/01029 , H01L2924/01083 , H01L2924/00015 , H01L2924/0665 , H01L2924/0695 , H01L2224/05599
摘要： A flip chip mounting method includes holding a circuit board (213) and a semiconductor chip (206), aligning the circuit board (213) with the semiconductor chip (206) while holding them with a predetermined gap therebetween, heating the circuit board (213) or the semiconductor chip (206) to a temperature at which solder powder in a solder resin composition (216) formed of solder powder (214) and a resin (215) is melted, supplying the solder resin composition (216) by a capillary phenomenon, and curing the resin (215), wherein the melted solder powder (214) in the solder resin composition (216) is moved through the predetermined gap across which the circuit board (213) and the semiconductor chip (206) are held, and self-assembled and grown, whereby the connection terminals (211) and the electrode terminals (207) are connected to each other electrically. According to this configuration, a flip chip mounting method having high productivity and reliability, which enables a next generation semiconductor chip to be mounted on a circuit board, a mounted body thereof, and a mounting apparatus thereof are provided.
摘要翻译： 一种倒装芯片安装方法，包括保持电路板（213）和半导体芯片（206），使电路板（213）与半导体芯片（206）保持一定间隔，同时将电路板（213）加热 ）或半导体芯片（206）的温度升高到由焊料粉末（214）和树脂（215）形成的焊料树脂组合物（216）中的焊料粉末熔化的温度，通过毛细管 现象，固化树脂（215），其中焊料树脂组合物（216）中的熔融焊料粉末（214）移动通过保持电路板（213）和半导体芯片（206）的预定间隙， 并且自组装和生长，由此连接端子（211）和电极端子（207）彼此电连接。 根据该结构，提供了一种能够将下一代半导体芯片安装在电路板上的高生产率和可靠性的倒装芯片安装方法及其安装体及其安装装置。
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