发明申请
- 专利标题： Wired circuit board and production method thereof
- 专利标题（中）： 有线电路板及其制作方法
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申请号： US11108720申请日： 2005-04-19
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公开(公告)号： US20050244620A1公开(公告)日： 2005-11-03
- 发明人: Makoto Tsunekawa , Kei Nakamura , Keiko Toyozawa , Takeshi Yamato , Toshikazu Baba
- 申请人： Makoto Tsunekawa , Kei Nakamura , Keiko Toyozawa , Takeshi Yamato , Toshikazu Baba
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 优先权： JPJP2004-135465 20040430
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K3/10 ; H05K3/24 ; H05K3/28 ; H05K3/38 ; B32B15/00 ; B05D5/12
摘要：
A wired circuit board which is formed so that even when a wired circuit pattern is formed at a fine pitch and then a tin plating layer is formed on the wired circuit pattern by the electroless tin plating, a wiring of the wired circuit pattern can be prevented from being stripped, and a production method of the same wired circuit board. After a thin metal film 2 formed of nickel-chromium alloy having a chromium content of 8-20 weight % is formed on an insulating layer 1, a wired circuit pattern 4 of copper is formed on the thin metal film 2. Then, a tin plating layer 5 is formed on exposed surfaces of the wired circuit pattern 4 by electroless tin plating.
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