-
公开(公告)号：US20050244620A1
公开(公告)日：2005-11-03
申请号：US11108720
申请日：2005-04-19
CPC分类号： H05K3/388 , H05K3/108 , H05K3/244 , H05K3/28 , H05K2203/072 , Y10T428/12715 , Y10T428/1291 , Y10T428/24917
摘要： A wired circuit board which is formed so that even when a wired circuit pattern is formed at a fine pitch and then a tin plating layer is formed on the wired circuit pattern by the electroless tin plating, a wiring of the wired circuit pattern can be prevented from being stripped, and a production method of the same wired circuit board. After a thin metal film 2 formed of nickel-chromium alloy having a chromium content of 8-20 weight % is formed on an insulating layer 1, a wired circuit pattern 4 of copper is formed on the thin metal film 2. Then, a tin plating layer 5 is formed on exposed surfaces of the wired circuit pattern 4 by electroless tin plating.
摘要翻译： 一种布线电路板，其形成为即使当以细间距形成布线电路图案，然后通过无电镀锡在布线电路图案上形成锡镀层时，可以防止布线电路图案的布线 被剥离，以及相同布线电路板的制造方法。 在绝缘层1上形成由铬含量为8〜20重量％的镍 - 铬合金形成的金属薄膜2之后，在金属薄膜2上形成铜布线电路图案4。 然后，通过无电镀锡在布线电路图案4的露出表面上形成镀锡层5。
-
公开(公告)号：US20070227372A1
公开(公告)日：2007-10-04
申请号：US11730033
申请日：2007-03-29
申请人： Makoto Tsunekawa , Toshikazu Baba
发明人： Makoto Tsunekawa , Toshikazu Baba
IPC分类号： B05C17/04
CPC分类号： H05K3/0091 , H05K1/0393 , H05K3/1216 , H05K3/28 , H05K2203/0759 , H05K2203/082 , H05K2203/1545
摘要： A printing apparatus includes a feed-out unit for feeding out an elongated base material which is wound up in a roll, a printing unit for printing a liquid resist onto the elongated base material that is fed out of the feed-out unit, a wind-up unit for winding up the elongated base material on which the liquid resist is printed by the printing unit into a roll, and a suction unit positioned between the printing unit and the wind-up unit in a transport direction of the elongated base material for sucking up a solvent in the liquid resist.
摘要翻译： 一种印刷装置，包括用于输出卷绕在卷筒中的细长基材的送出单元，用于将液体抗蚀剂印刷到从送出单元送出的细长基材上的印刷单元， 用于将由印刷单元印刷有液体抗蚀剂的细长基材卷绕成卷的单元，以及在细长基材的输送方向上位于印刷单元和卷绕单元之间的抽吸单元， 吸取液体抗蚀剂中的溶剂。
-
公开(公告)号：US07798062B2
公开(公告)日：2010-09-21
申请号：US11730033
申请日：2007-03-29
申请人： Makoto Tsunekawa , Toshikazu Baba
发明人： Makoto Tsunekawa , Toshikazu Baba
IPC分类号： B41M1/12
CPC分类号： H05K3/0091 , H05K1/0393 , H05K3/1216 , H05K3/28 , H05K2203/0759 , H05K2203/082 , H05K2203/1545
摘要： A printing apparatus includes a feed-out unit for feeding out an elongated base material which is wound up in a roll, a printing unit for printing a liquid resist onto the elongated base material that is fed out of the feed-out unit, a wind-up unit for winding up the elongated base material on which the liquid resist is printed by the printing unit into a roll, and a suction unit positioned between the printing unit and the wind-up unit in a transport direction of the elongated base material for sucking up a solvent in the liquid resist.
摘要翻译： 一种印刷装置，包括用于输出卷绕在卷筒中的细长基材的送出单元，用于将液体抗蚀剂印刷到从送出单元送出的细长基材上的印刷单元， 用于将由印刷单元印刷有液体抗蚀剂的细长基材卷绕成卷的单元，以及在细长基材的输送方向上位于印刷单元和卷绕单元之间的抽吸单元， 吸取液体抗蚀剂中的溶剂。
-
公开(公告)号：US20050079652A1
公开(公告)日：2005-04-14
申请号：US10959108
申请日：2004-10-07
申请人： Mineyoshi Hasegawa , Kei Nakamura , Toshikazu Baba
发明人： Mineyoshi Hasegawa , Kei Nakamura , Toshikazu Baba
CPC分类号： H05K3/0038 , H05K1/0393 , H05K3/386 , H05K3/427 , H05K3/429 , H05K3/4626 , H05K3/4635 , H05K3/4652 , H05K3/4655 , H05K2201/0195
摘要： A method of producing a multilayer wired circuit board that can suppress making gouge in an adhesive layer when a hole is formed by irradiation with a laser beam, to provide a smoothened inside surface of the hole so as to provide enhanced reliability of electrical connection. A first substrate 4 having the structure wherein a first metal foil 2 and a second metal foil 3 are formed on both sides of a first insulating layer 1 and a second substrate 7 having the structure wherein a third metal foil 6 is formed on a single side of a second insulating layer 5 are prepared, separately. Then, the first metal foil 2 of the first substrate 4 and the second insulating layer 5 of the second substrate 7 are bonded together through an adhesive layer 8. Thereafter, the resultant laminate is irradiated with a laser beam emitting from the first substrate 4 side toward the second substrate 7 side, to form a through hole 9. When the through hole 9 is formed, the adhesive layer 8 is irradiated with the laser beam decayed in energy after applied to the second metal foil 3 and the first metal foil 2. Hence, the adhesive layer can be prevented from being gouged by thermal decomposition, and as such can permit a smoothened inside surface of the through hole 9.
摘要翻译： 一种制造多层布线电路板的方法，该多层布线电路板可以通过用激光束照射形成孔而能够抑制在粘合剂层中产生气泡，从而提供孔的光滑的内表面，从而提高电连接的可靠性。 具有这样的结构的第一基板4，其中在第一绝缘层1和第二基板7的两侧形成有第一金属箔2和第二金属箔3，第二基板7具有在第一金属箔6的单侧上形成第三金属箔6 分别制备第二绝缘层5。 然后，第一基板4的第一金属箔2和第二基板7的第二绝缘层5通过粘合层8接合在一起。然后，用从第一基板4侧发射的激光束照射所得到的层压体 朝向第二基板7侧形成通孔9.当形成通孔9时，在施加到第二金属箔3和第一金属箔2上之后，用能量衰减的激光束照射粘合剂层8。 因此，可以防止粘合剂层因热分解而被破坏，因此能够使通孔9的内表面平滑化。
-
公开(公告)号：US5977783A
公开(公告)日：1999-11-02
申请号：US817944
申请日：1997-04-28
申请人： Yoshinari Takayama , Toshikazu Baba , Atsushi Hino , Ichiro Amino
发明人： Yoshinari Takayama , Toshikazu Baba , Atsushi Hino , Ichiro Amino
CPC分类号： G01R1/07314 , G01R1/06761 , H05K3/4007
摘要： A probe structure containing a contact part (2) formed on one side (1a) of an insulating substrate (1), a conductive circuit (3) formed on the other side (1b) of the insulating substrate (1), wherein the contact part (2) and the conductive circuit (3) are connected via a conductive path (5) formed in a through-hole (4) in the thickness direction of the insulating substrate (1). The contact part (2) has a structure containing a deep layer (1c) having a hardness of 100-700 Hk, an intermediate layer (1b) having a hardness of 10-300 Hk, and a surface layer (1a) having a hardness of 700-1200 Hk successively laminated. The surface layer (1a) preferably has a tensile stress of not more than 50 kg/mm.sup.2. The probe structure maintains low and stable contact resistance in an electric test, in particular a burn-in test, of small test objects such as IC. In a test method wherein a solder bump is formed in a test object and utilized, the solder component of the test object does not adhere to the contact part (2) after testing. The probe structure suffers less from deterioration of contact state after repetitive open/close contact with the test object as compared to the initial contact state, and highly reliable electric testing can be performed.
摘要翻译： PCT No.PCT / JP95 / 02092 Sec。 371日期1997年04月28日 102（e）日期1997年4月28日PCT提交1995年10月12日PCT公布。 第WO96 / 13728号公报 日期：1996年5月9日包括形成在绝缘基板（1）的一侧（1a）上的接触部分（2）的探针结构，形成在绝缘基板（1）的另一侧（1b）上的导电电路（3） ，其中所述接触部分（2）和所述导电电路（3）经由形成在所述绝缘基板（1）的厚度方向上的通孔（4）中的导电路径（5）连接。 接触部分（2）具有包含硬度为100-700Hk的深层（1c），硬度为10-300Hk的中间层（1b）和硬度为10-300Hk的中间层（1b）的结构， 700-1200 Hk依次层压。 表面层（1a）优选具有不大于50kg / mm2的拉伸应力。 探针结构在诸如IC的小型测试对象的电测试（特别是老化测试）中保持低且稳定的接触电阻。 在测试对象中形成焊料凸点并使用的测试方法中，测试对象的焊料组分在测试后不粘附到接触部分（2）。 与初始接触状态相比，在与被测物体重复开/闭接触之后，探针结构的接触状态劣化较少，能够进行高可靠性的电气测试。
-
公开(公告)号：US08372903B2
公开(公告)日：2013-02-12
申请号：US12849896
申请日：2010-08-04
IPC分类号： C08K5/5399
摘要： A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1):
-
7.发明申请PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND CIRCUIT BOARD PRODUCTION METHOD 失效感光树脂组合物，使用其的柔性电路板和电路板生产方法公开(公告)号：US20100270060A1
公开(公告)日：2010-10-28
申请号：US12766352
申请日：2010-04-23
申请人： Masaki Mizutani , Toshikazu Baba
发明人： Masaki Mizutani , Toshikazu Baba
CPC分类号： G03F7/033 , G03F7/032 , H05K1/0393 , H05K3/287
摘要： A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260° C. after being cured.
摘要翻译： 提供了具有阻焊剂所必需的性质（绝缘性，焊料耐热性，碱显影性等）的感光性树脂组合物，并且即使在IR回流工艺之后也能够形成耐折叠性优异的膜。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; 和（D）光聚合引发剂。 感光性树脂组合物在固化后的拉伸断裂伸长率为10％以上，2％重量减少温度为260℃以上。
-
8.发明授权Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method 失效光敏树脂组合物，采用该柔性电路板的电路板生产方法公开(公告)号：US08492453B2
公开(公告)日：2013-07-23
申请号：US12766352
申请日：2010-04-23
申请人： Masaki Mizutani , Toshikazu Baba
发明人： Masaki Mizutani , Toshikazu Baba
IPC分类号： C07D303/40
CPC分类号： G03F7/033 , G03F7/032 , H05K1/0393 , H05K3/287
摘要： A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260° C. after being cured.
摘要翻译： 提供了具有阻焊剂所必需的性质（绝缘性，焊料耐热性，碱显影性等）的感光性树脂组合物，并且即使在IR回流工艺之后也能够形成耐折叠性优异的膜。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; 和（D）光聚合引发剂。 感光性树脂组合物在固化后的拉伸断裂伸长率为10％以上，2％重量减少温度为260℃以上。
-
9.发明授权Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method 失效光敏树脂组合物，采用该柔性电路板的电路板生产方法公开(公告)号：US08455577B2
公开(公告)日：2013-06-04
申请号：US12849896
申请日：2010-08-04
IPC分类号： C08K5/5399
CPC分类号： G03F7/032 , G03F7/033 , H05K1/0393 , H05K3/287
摘要： A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1):
摘要翻译： 提供了一种无卤阻燃感光性树脂组合物，其具有阻焊剂所需的性质（绝缘性，焊料耐热性，碱显影性等），并且能够形成耐折性优异的膜 经过IR回流处理。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; （D）光聚合引发剂; 和由以下通式（1）表示的环状磷腈（E）：
-
10.发明申请PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND CIRCUIT BOARD PRODUCTION METHOD 失效感光树脂组合物，使用其的柔性电路板和电路板生产方法公开(公告)号：US20110030998A1
公开(公告)日：2011-02-10
申请号：US12849896
申请日：2010-08-04
CPC分类号： G03F7/032 , G03F7/033 , H05K1/0393 , H05K3/287
摘要： A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1):
摘要翻译： 提供了一种无卤阻燃感光性树脂组合物，其具有阻焊剂所需的性质（绝缘性，焊料耐热性，碱显影性等），并且能够形成耐折性优异的膜 经过IR回流处理。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; （D）光聚合引发剂; 和由以下通式（1）表示的环状磷腈（E）：
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.02 秒)
