发明申请
- 专利标题： Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
- 专利标题（中）： 激光加工方法，激光加工装置及三维结构
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申请号： US11174471申请日： 2005-07-06
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公开(公告)号： US20050244622A1公开(公告)日： 2005-11-03
- 发明人: Yasufumi Yamada , Katsumi Midorikawa , Hiroshi Kumagai
- 申请人： Yasufumi Yamada , Katsumi Midorikawa , Hiroshi Kumagai
- 优先权： JP2002-044640 20020221
- 主分类号： B81C1/00
- IPC分类号： B81C1/00 ; B23K26/00 ; B23K26/06 ; B23K26/073 ; B23K26/18 ; B23K26/38 ; C03C17/00 ; C03C17/06 ; C03C23/00 ; H05K1/03 ; H05K3/00 ; H05K3/02 ; B32B15/00
摘要：
A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
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