发明申请
- 专利标题： Semiconductor chip arrangement and method
- 专利标题（中）： 半导体芯片布置和方法
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申请号： US11120838申请日： 2005-05-03
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公开(公告)号： US20050250245A1公开(公告)日： 2005-11-10
- 发明人: Edmund Riedl , Ralf Otremba , Ivan Galesic
- 申请人： Edmund Riedl , Ralf Otremba , Ivan Galesic
- 优先权： DE102004021633.9 20040503
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/58 ; H01L21/60 ; H01L21/603 ; H01L23/12 ; H01L23/13 ; H01L23/488
摘要：
A semiconductor chip arrangement and method is disclosed. In one embodiment, the invention provides a method for providing a semiconductor chip arrangement including providing a semiconductor chip having a first connecting area, and providing a chip carrier having a concave shaped section formed in a second connecting area. A connecting mechanism is provided between the first connecting area and the second connecting area and pressing the semiconductor chip onto the chip carrier such that the connecting mechanism positively locks the first connecting area to the concave shaped section of the second connecting area.
公开/授权文献
- US07511382B2 Semiconductor chip arrangement and method 公开/授权日：2009-03-31
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