发明申请
US20060079085A1 Method for applying metal features onto metallized layers using electrochemical deposition
审中-公开
使用电化学沉积将金属特征施加到金属化层上的方法
- 专利标题： Method for applying metal features onto metallized layers using electrochemical deposition
- 专利标题（中）： 使用电化学沉积将金属特征施加到金属化层上的方法
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申请号： US11286084申请日： 2005-11-23
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公开(公告)号： US20060079085A1公开(公告)日： 2006-04-13
- 发明人: Rajesh Baskaran , Bioh Kim , Linlin Chen , Lyndon Graham
- 申请人： Rajesh Baskaran , Bioh Kim , Linlin Chen , Lyndon Graham
- 申请人地址： US MT Kalispell
- 专利权人： Semitool, Inc.
- 当前专利权人： Semitool, Inc.
- 当前专利权人地址： US MT Kalispell
- 主分类号： C25D5/34
- IPC分类号： C25D5/34 ; H01L21/44
摘要：
The present invention is directed to a process for producing structures containing metallized features for use in microelectronic workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
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