发明申请
- 专利标题： FLUIDIC COOLING SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS
- 专利标题（中）： 流体冷却系统和电子元件的方法
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申请号： US10904555申请日： 2004-11-16
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公开(公告)号： US20060104031A1公开(公告)日： 2006-05-18
- 发明人: Evan Colgan , Frank Pompeo , Glenn Daves , Hilton Toy , Bruce Furman , David Edwards , Michael Gaynes , Mukta Farooq , Sung Kang , Steven Ostrander , Jaimal Williamson , Da-Yuan Shih , Donald Henderson
- 申请人： Evan Colgan , Frank Pompeo , Glenn Daves , Hilton Toy , Bruce Furman , David Edwards , Michael Gaynes , Mukta Farooq , Sung Kang , Steven Ostrander , Jaimal Williamson , Da-Yuan Shih , Donald Henderson
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.
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