公开(公告)号：US20060104031A1

公开(公告)日：2006-05-18

申请号：US10904555

申请日：2004-11-16

申请人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

发明人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

摘要翻译： 提供了一种用于组件载体上的电子部件的冷却系统。 该系统包括框架，喷雾歧管和密封构件。 框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。 喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。 喷雾歧管在后表面喷洒冷却液。 密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。

公开(公告)号：US20080265404A1

公开(公告)日：2008-10-30

申请号：US11742161

申请日：2007-04-30

申请人： Bruce Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Yves Martin ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

发明人： Bruce Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Yves Martin ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

摘要翻译： 公开了用于从集成电路和电路芯片散热的组件。 组件包括作为用于将热从芯片传递到散热器（HS）的热界面材料（TIM）的低熔点焊料，其中低熔点焊料的熔点低于芯片的最大工作温度。 还公开了制造组件的方法。

公开(公告)号：US07898076B2

公开(公告)日：2011-03-01

申请号：US11742161

申请日：2007-04-30

申请人： Bruce Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Yves Martin ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

发明人： Bruce Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Yves Martin ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

IPC分类号： H01L23/10

CPC分类号： H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

摘要翻译： 公开了用于从集成电路和电路芯片散热的组件。 组件包括作为用于将热从芯片传递到散热器（HS）的热界面材料（TIM）的低熔点焊料，其中低熔点焊料的熔点低于芯片的最大工作温度。 还公开了制造组件的方法。

公开(公告)号：US20070014527A1

公开(公告)日：2007-01-18

申请号：US11524597

申请日：2006-09-21

申请人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

发明人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

IPC分类号： G02B6/00

CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/423

摘要： Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

摘要翻译： 用于安装光纤的光学装置，部件和方法以及用于使用改进的硅V形槽或光纤V沟槽阵列将光耦合到光纤的光纤，其中V形槽被设计用于精确对准/间隔光学 纤维在硅的表面下“凹进”。 光纤可以在硅衬底的表面下方凹入，从而可以去除（重叠）在硅表面之上延伸的覆层的精确控制部分。 当去除包覆层时，可以减小光纤芯和光电子器件之间的分离，从而当光纤硅阵列连接到例如VCSEL阵列时改善光耦合。

公开(公告)号：US20060108675A1

公开(公告)日：2006-05-25

申请号：US10993548

申请日：2004-11-19

申请人： Evan Colgan ,  Bruce Furman ,  Christopher Jahnes

发明人： Evan Colgan ,  Bruce Furman ,  Christopher Jahnes

IPC分类号： H01L21/50 ,  H01L23/06 ,  H01L21/48 ,  H01L21/44

CPC分类号： B81C1/00293 ,  B81C2203/0145

摘要： Apparatus and methods are provided for enabling wafer-scale encapsulation of microelectromechanical (MEM) devices (e.g., resonators, filters) to protect the MEMs from the ambient and to provide either a controlled ambient or a reduced pressure. In particular, methods for wafer-scale encapsulation of MEM devices are provided, which enable encapsulation of MEM devices under desired ambient conditions that are not determined by the deposition conditions of a sealing process in which MEM release via holes are sealed or pinched-off, and which prevent sealing material from being inadvertently deposited on the MEM device during the sealing process.

摘要翻译： 提供了设备和方法，用于实现微机电（MEM）装置（例如，谐振器，滤波器）的晶片级封装，以保护MEM免受环境影响，并提供受控的环境或减压。 特别地，提供了用于MEM器件的晶片级封装的方法，其能够在期望的环境条件下封装MEM器件，所述环境条件不是通过其中MEM释放通孔被密封或夹断的密封过程的沉积条件来确定的， 并且其在密封过程中防止密封材料被无意中沉积在MEM装置上。

公开(公告)号：US20050169597A1

公开(公告)日：2005-08-04

申请号：US11096424

申请日：2005-04-01

申请人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

发明人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

IPC分类号： G02B6/36 ,  G02B6/42 ,  G02B6/00

CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/423

摘要： Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

公开(公告)号：US20050058408A1

公开(公告)日：2005-03-17

申请号：US10667234

申请日：2003-09-17

申请人： Evan Colgan ,  Bruce Furman ,  Daniel Stigliani

发明人： Evan Colgan ,  Bruce Furman ,  Daniel Stigliani

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4214 ,  G02B6/4246 ,  G02B6/4249

摘要： An optoelectronic assembly for an electronic system includes a support electronic chip set configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions. A first substrate having a first surface and an opposite second surface is in communication with the support electronic chip set via the first surface while a second substrate is in communication with the second surface of the first substrate. The second substrate is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set and an optical fiber array is aligned at a first end with the optoelectronic transducer and with an optical signaling medium at a second end. An electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via an electrical signaling medium, and the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

公开(公告)号：US20070057624A1

公开(公告)日：2007-03-15

申请号：US11472959

申请日：2006-06-22

申请人： Marie Angelopoulos ,  Christos Dimitrakopoulos ,  Bruce Furman ,  Teresita Graham ,  Shui-Chih Lien

发明人： Marie Angelopoulos ,  Christos Dimitrakopoulos ,  Bruce Furman ,  Teresita Graham ,  Shui-Chih Lien

IPC分类号： H05B33/00 ,  H01L51/50

CPC分类号： H01L51/5203 ,  C08G61/12 ,  G02F1/13439 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01J29/868 ,  H01L21/0332 ,  H01L21/31138 ,  H01L23/49894 ,  H01L23/60 ,  H01L29/456 ,  H01L29/458 ,  H01L29/4908 ,  H01L33/38 ,  H01L33/42 ,  H01L51/0018 ,  H01L51/0021 ,  H01L51/0023 ,  H01L51/0504 ,  H01L51/0508 ,  H01L51/0512 ,  H01L51/0545 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5234 ,  H01L2251/5323 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  Y10T428/10 ,  Y10T428/1055 ,  Y10T428/12528 ,  Y10T428/24331 ,  Y10T428/31504 ,  Y10T428/31533 ,  Y10T428/31678 ,  Y10T428/31692 ,  H01L2924/00

摘要： Electronic devices having patterned electrically conductive polymers providing electrical connection thereto and methods of fabrication thereof are described. Liquid crystal display cells are described having at least one of the electrodes providing a bias across the liquid crystal material formed from a patterned electrically conductive polymer. Thin film transistors having patterned electrically conductive polymers as source drain and gate electrodes are described. Light emitting diodes having anode and coated regions formed from patterned electrically conductive polymers are described. Methods of patterning using a resist mask; patterning using a patterned metal layer; patterning the metal layer using a resist; and patterning the electrically conductive polymer directly to form electrodes and anode and cathode regions are described.

公开(公告)号：US07056648B2

公开(公告)日：2006-06-06

申请号：US10664017

申请日：2003-09-17

申请人： Emanuel Cooper ,  Bruce Furman ,  David Rath

发明人： Emanuel Cooper ,  Bruce Furman ,  David Rath

IPC分类号： G03F7/34 ,  C23F1/18

CPC分类号： C23G1/103 ,  C23C22/63 ,  C23F1/34 ,  H01L21/32134

摘要： Copper and copper alloys are etched to provide uniform and smooth surface by employing an aqueous composition that comprises an oxidant, a mixture of at least one weak complexant and at least one strong complexant for the copper or copper alloy, and water and has a pH of about 6 to about 12 so as to form an oxidized etch controlling layer and to uniformly remove the copper or copper alloy; and then removing the oxidized etch controlling layer with a non-oxidizing composition. Copper and copper alloy structure, having smooth upper surfaces are also provided.

公开(公告)号：US20100236603A1

公开(公告)日：2010-09-23

申请号：US12702841

申请日：2010-02-09

申请人： Etienne Menard ,  Christopher Bower ,  Scott Burroughs ,  Joe Carr ,  Bob Conner ,  Sergiy Dets ,  Bruce Furman ,  Matthew Meitl ,  Michael Sullivan

发明人： Etienne Menard ,  Christopher Bower ,  Scott Burroughs ,  Joe Carr ,  Bob Conner ,  Sergiy Dets ,  Bruce Furman ,  Matthew Meitl ,  Michael Sullivan

IPC分类号： H01L31/052 ,  H01L31/18

CPC分类号： G02B19/0076 ,  G02B3/0056 ,  G02B19/0014 ,  G02B19/0042 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/0543 ,  H01L31/0547 ,  Y02E10/52

摘要： CPV modules include a back plate having an array of 1 mm2 or smaller solar cells thereon. A backplane interconnect network is also provided on the back plate. This backplane interconnect network operates to electrically connect the array of solar cells together. A front plate, which is spaced-apart from the back plate, is provided. This front plate includes an array of primary lenses thereon that face the array of solar cells. The front plate can be configured to provide a greater than 1000× lens-to-cell light concentration to the array of solar cells. To achieve this 1000× lens-to-cell light concentration, the primary lenses can be configured as plano-convex lenses having a lens sag of less than about 4 mm. An array of secondary optical elements may also be provided, which extend between the array of primary lenses and the array of solar cells.

摘要翻译： CPV模块包括其上具有1mm 2或更小的太阳能电池阵列的背板。 背板互连网络也设置在背板上。 该背板互连网络用于将太阳能电池阵列电连接在一起。 提供了与背板间隔开的前板。 该前板包括面向太阳能电池阵列的主镜阵列。 前板可以配置为向太阳能电池阵列提供大于1000倍的透镜到单元的光浓度。 为了实现这种1000×透镜到单元光的浓度，主透镜可以被配置为具有小于约4mm的透镜凹陷的平凸透镜。 还可以提供在主要透镜阵列和太阳能电池阵列之间延伸的次级光学元件阵列。