发明申请
- 专利标题： Calibration on wafer sweet spots
- 专利标题（中）： 校准晶圆甜点
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申请号： US11139551申请日： 2005-05-31
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公开(公告)号： US20060266243A1公开(公告)日： 2006-11-30
- 发明人: Gokhan Percin , Ram Ramanujam , Franz Zach , Abdurrahman Sezginer , Chi-Song Horng , Roy Prasad
- 申请人： Gokhan Percin , Ram Ramanujam , Franz Zach , Abdurrahman Sezginer , Chi-Song Horng , Roy Prasad
- 专利权人： Invarium Inc.
- 当前专利权人： Invarium Inc.
- 主分类号： B41F33/00
- IPC分类号： B41F33/00 ; B41F1/54
摘要：
A method for generating an OPC model is provided which takes into consideration across-wafer variations which occur during the process of manufacturing semiconductor chips. More particularly, a method for generating an OPC model is provided which takes into consideration across-wafer variations which occur during the process of manufacturing semiconductor chips based on the parameters of test patterns measured at the “wafer sweet spots” so as to arrive at an accurate model.
公开/授权文献
- US07444615B2 Calibration on wafer sweet spots 公开/授权日：2008-10-28
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