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公开(公告)号：US07743359B2
公开(公告)日：2010-06-22
申请号：US11203330
申请日：2005-08-13
IPC分类号： G06F17/50
CPC分类号： G06F17/5009 , G03F1/36 , G03F7/70441 , G06F17/5068
摘要： An apparatus and method of synthesizing a photolithographic data set includes using a first computational model to calculate a first figure-of-merit for the photolithographic data set; changing a first part of the photolithographic data set to increase the first figure-of-merit; and then using a second computational model to calculate a second figure-of-merit of the photolithographic data set; and changing a second part of the photolithographic data set to increase the second figure-of-merit. The second computational model enables figure-of-merit calculations to be executed at a significantly faster execution rate than the first computational model.
摘要翻译： 合成光刻数据集的装置和方法包括使用第一计算模型来计算光刻数据集的第一像素值; 改变光刻数据集的第一部分以增加第一品质因数; 然后使用第二计算模型来计算光刻数据集的第二像素值; 以及改变光刻数据集的第二部分以增加第二品质因数。 第二种计算模型能够以比第一种计算模型快得多的执行速度执行品质因数计算。
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公开(公告)号：US20060266243A1
公开(公告)日：2006-11-30
申请号：US11139551
申请日：2005-05-31
申请人： Gokhan Percin , Ram Ramanujam , Franz Zach , Abdurrahman Sezginer , Chi-Song Horng , Roy Prasad
发明人： Gokhan Percin , Ram Ramanujam , Franz Zach , Abdurrahman Sezginer , Chi-Song Horng , Roy Prasad
CPC分类号： G03F7/70441 , G03F1/36 , G03F1/44 , G03F1/68
摘要： A method for generating an OPC model is provided which takes into consideration across-wafer variations which occur during the process of manufacturing semiconductor chips. More particularly, a method for generating an OPC model is provided which takes into consideration across-wafer variations which occur during the process of manufacturing semiconductor chips based on the parameters of test patterns measured at the “wafer sweet spots” so as to arrive at an accurate model.
摘要翻译： 提供了一种产生OPC模型的方法，其考虑了在制造半导体芯片的过程中发生的跨晶片变化。 更具体地，提供了一种用于生成OPC模型的方法，其考虑了在基于在“晶片甜点”处测量的测试图案的参数的制造半导体芯片的过程期间发生的跨晶片变化，以便到达 准确模型。
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公开(公告)号：US20060248498A1
公开(公告)日：2006-11-02
申请号：US11203330
申请日：2005-08-13
IPC分类号： G06F17/50
CPC分类号： G06F17/5009 , G03F1/36 , G03F7/70441 , G06F17/5068
摘要： An apparatus and method of synthesizing a photolithographic data set includes using a first computational model to calculate a first figure-of-merit for the photolithographic data set; changing a first part of the photolithographic data set to increase the first figure-of-merit; and then using a second computational model to calculate a second figure-of-merit of the photolithographic data set; and changing a second part of the photolithographic data set to increase the second figure-of-merit. The second computational model enables figure-of-merit calculations to be executed at a significantly faster execution rate that the first computational model.
摘要翻译： 合成光刻数据集的装置和方法包括使用第一计算模型来计算光刻数据集的第一像素值; 改变光刻数据集的第一部分以增加第一品质因数; 然后使用第二计算模型来计算光刻数据集的第二像素值; 以及改变光刻数据集的第二部分以增加第二品质因数。 第二计算模型使得能够以优于第一计算模型的执行速率执行优质图计算。
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公开(公告)号：US07506300B2
公开(公告)日：2009-03-17
申请号：US11203522
申请日：2005-08-13
申请人： Abdurrahman Sezginer , Roy Prasad
发明人： Abdurrahman Sezginer , Roy Prasad
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , G03F1/36 , G03F7/70291 , G03F7/70441
摘要： A method of modifying polygons in a data set mask-less or mask based optical projection lithography includes: 1) mapping the data set to a figure-of-demerit; 2) moving individual polygon edges to decrease the figure-of-demerit; and 3) disrupting the set of polygons to enable a further decrease in the figure-of-demerit, wherein disrupting polygons includes any of the following polygon disruptions: breaking up, merging, or deleting polygons.
摘要翻译： 一种在数据集无掩模或基于掩模的光学投影光刻中修改多边形的方法包括：1）将数据集映射到数字图; 2）移动单个多边形边缘以减少缺点; 并且3）中断多边形集合以使得进一步减少数字，其中中断的多边形包括以下任何多边形中断：分解，合并或删除多边形。
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公开(公告)号：US07444615B2
公开(公告)日：2008-10-28
申请号：US11139551
申请日：2005-05-31
申请人： Gokhan Percin , Ram S. Ramanujam , Franz X. Zach , Abdurrahman Sezginer , Chi-Song Horng , Roy Prasad
发明人： Gokhan Percin , Ram S. Ramanujam , Franz X. Zach , Abdurrahman Sezginer , Chi-Song Horng , Roy Prasad
IPC分类号： G06F17/50
CPC分类号： G03F7/70441 , G03F1/36 , G03F1/44 , G03F1/68
摘要： A method for generating an OPC model is provided which takes into consideration across-wafer variations which occur during the process of manufacturing semiconductor chips. More particularly, a method for generating an OPC model is provided which takes into consideration across-wafer variations which occur during the process of manufacturing semiconductor chips based on the parameters of test patterns measured at the “wafer sweet spots” so as to arrive at an accurate model.
摘要翻译： 提供了一种产生OPC模型的方法，其考虑了在制造半导体芯片的过程中发生的跨晶片变化。 更具体地，提供了一种用于生成OPC模型的方法，其考虑了在基于在“晶片甜点”处测量的测试图案的参数的制造半导体芯片的过程期间发生的跨晶片变化，以便到达 准确模型。
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公开(公告)号：US20060248499A1
公开(公告)日：2006-11-02
申请号：US11203522
申请日：2005-08-13
申请人： Abdurrahman Sezginer , Roy Prasad
发明人： Abdurrahman Sezginer , Roy Prasad
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , G03F1/36 , G03F7/70291 , G03F7/70441
摘要： A method of modifying polygons in a data set mask-less or mask based optical projection lithography includes: 1) mapping the data set to a figure-of-demerit; 2) moving individual polygon edges to decrease the figure-of-demerit; and 3) disrupting the set of polygons to enable a further decrease in the figure-of-demerit, wherein disrupting polygons includes any of the following polygon disruptions: breaking up, merging, or deleting polygons.
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