发明申请
- 专利标题： Apparatus for manufacturing a wiring board and method for manufacturin a wiring board
- 专利标题（中）： 一种布线板的制造装置及其制造方法
-
申请号： US11580162申请日： 2006-10-13
-
公开(公告)号： US20070044294A1公开(公告)日： 2007-03-01
- 发明人: Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
- 申请人： Kenji Sasaoka , Fumitoshi Ikegaya , Takahiro Mori , Tomohisa Motomura , Yoshizumi Sato , Koichiro Shibayama
- 申请人地址： JP Tokyo
- 专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JPP9-155462 19970612
- 主分类号： B23P23/00
- IPC分类号： B23P23/00 ; H05K3/36
摘要：
The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.
公开/授权文献
- US07526859B2 Apparatus for manufacturing a wiring board 公开/授权日：2009-05-05
信息查询
