发明申请
- 专利标题: Semiconductor device and fabrication method thereof
- 专利标题(中): 半导体器件及其制造方法
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申请号: US11261200申请日: 2005-10-28
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公开(公告)号: US20070096326A1公开(公告)日: 2007-05-03
- 发明人: Hui-Lin Chang , Yung-Cheng Lu , Chung-Chi Ko , Pi-Tsung Chen , Shau-Lin Shue , Chien-Hsueh Shih , Hung-Wen Su , Ming-Hsing Tsai
- 申请人: Hui-Lin Chang , Yung-Cheng Lu , Chung-Chi Ko , Pi-Tsung Chen , Shau-Lin Shue , Chien-Hsueh Shih , Hung-Wen Su , Ming-Hsing Tsai
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
Semiconductor devices and methods for fabricating the same. The devices include a substrate, a catalyst layer, a second dielectric layer, and carbon nanotubes (CNTs). The substrate comprises an overlying first dielectric layer with an electrode embedded therein. The catalyst layer overlies the electrode and the first dielectric layer and substantially comprises Co and M1, wherein M1 is selected from a group consisting of W, P, B, Bi, Ni, and a combination thereof. The second dielectric layer overlies the catalyst layer and comprises an opening exposing parts of the catalyst layer. The carbon nanotubes (CNTs) are disposed on the exposed catalyst layer and electrically connect the electrode.
公开/授权文献
- US07312531B2 Semiconductor device and fabrication method thereof 公开/授权日:2007-12-25
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