发明申请
- 专利标题: Drying apparatus, drying method, substrate processing apparatus, substrate processing method, and program recording medium
- 专利标题(中): 干燥装置,干燥方法,基板处理装置,基板处理方法和程序记录介质
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申请号: US11594232申请日: 2006-11-08
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公开(公告)号: US20070113423A1公开(公告)日: 2007-05-24
- 发明人: Hiroshi Tanaka , Hidetoshi Nakao , Naoki Shindo , Atushi Yamashita , Tsukasa Hirayama , Kotaro Tsurusaki
- 申请人: Hiroshi Tanaka , Hidetoshi Nakao , Naoki Shindo , Atushi Yamashita , Tsukasa Hirayama , Kotaro Tsurusaki
- 优先权: JP2005-334538 20051118; JP2006-216464 20060809
- 主分类号: F26B3/00
- IPC分类号: F26B3/00
摘要:
The present invention provides a drying apparatus capable of satisfactorily drying a workpiece by using a dry vapor The drying apparatus has a control device for controlling a supply of a carrier gas and a supply of a dry vapor into a processing tank holding workpieces. A drying process carries out a carrier gas supply step of supplying the carrier gas and a mixed fluid supply step of supplying a mixed fluid prepared by mixing the carrier gas and the dry vapor alternately. A total mixed fluid supply time for which the mixed fluid supply step is executed is not shorter than 57% of a total processing time for which the carrier gas supply step and the mixed fluid supply step are executed.
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