发明申请
- 专利标题： NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC OR CONDUCTIVE MATERIALS
- 专利标题（中）： 使用压电材料或导电材料改善敏感性的粘结粘结结构的非结构可靠性监测方法
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申请号： US11752159申请日： 2007-05-22
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公开(公告)号： US20070214623A1公开(公告)日： 2007-09-20
- 发明人: DAI-GIL LEE , HUI-YUN HWANG , WOO-SEOK CHIN , SEUNG-MIN LEE , BYUNG-CHUL KIM , JAE-WOOK KWON , SOON-HO YOON
- 申请人： DAI-GIL LEE , HUI-YUN HWANG , WOO-SEOK CHIN , SEUNG-MIN LEE , BYUNG-CHUL KIM , JAE-WOOK KWON , SOON-HO YOON
- 申请人地址： KR DAEJEON 305-701
- 专利权人： KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- 当前专利权人： KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- 当前专利权人地址： KR DAEJEON 305-701
- 优先权： KR10-2004-0096491 20041123
- 主分类号： H04R17/00
- IPC分类号： H04R17/00 ; H01L41/00 ; G01R31/28
摘要：
A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.
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