公开(公告)号：US20070214623A1

公开(公告)日：2007-09-20

申请号：US11752159

申请日：2007-05-22

申请人： DAI-GIL LEE ,  HUI-YUN HWANG ,  WOO-SEOK CHIN ,  SEUNG-MIN LEE ,  BYUNG-CHUL KIM ,  JAE-WOOK KWON ,  SOON-HO YOON

发明人： DAI-GIL LEE ,  HUI-YUN HWANG ,  WOO-SEOK CHIN ,  SEUNG-MIN LEE ,  BYUNG-CHUL KIM ,  JAE-WOOK KWON ,  SOON-HO YOON

IPC分类号： H04R17/00 ,  H01L41/00 ,  G01R31/28

CPC分类号： G01N29/045 ,  G01N27/24 ,  G01N2291/0231 ,  G01N2291/02863 ,  Y10T29/42 ,  Y10T29/49004

摘要： A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life.

摘要翻译： 公开了一种用于以更高的灵敏度和非破坏性的方式测试接合结构的接合部件完整性的方法。 该方法包括以下步骤：将压电材料或导电材料与粘合剂混合，在粘合目标物体之间固化粘合剂，将结合目标物体彼此电连接，使电流流过结合 目标物体，以测量在接合目标物体之间流动的电荷量，并且基于电荷量确定接合目标物体和粘合剂之间的接合损伤的存在，并且基于以下方式预测接合结构体的剩余寿命： 指示电荷量与预定疲劳寿命之间的相关性的数据。