发明申请
- 专利标题： SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US11678996申请日： 2007-02-26
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公开(公告)号： US20070273018A1公开(公告)日： 2007-11-29
- 发明人: Yutaka Onozuka , Hiroshi Yamada , Hideyuki Funaki , Kazuhiko Itaya
- 申请人： Yutaka Onozuka , Hiroshi Yamada , Hideyuki Funaki , Kazuhiko Itaya
- 申请人地址： JP Tokyo
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2006-091242 20060329
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/00
摘要：
It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip comprising a semiconductor device formed therein; and an adhesive layer bonding a side face of the first chip to a side face of the second chip, and having a lower Young's modulus than the material of the first and second chips.