A full wafer inspection apparatus and a manufacturing method of a semiconductor device capable of collectively and precisely inspecting semiconductor elements formed on a wafer, while securing the positional accuracy of tip portions of contact terminals are provided. A probe cassette used in a semiconductor inspection apparatus includes: a probe sheet 31 having a plurality of contact terminals 7 which contact electrodes 3 of a wafer 1 and a plurality of contact bumps 20b electrically connected to respective contact terminals 7; and a probe sheet 34 having a plurality of contact electrodes 34a which contact the contact bumps 20b of the probe sheet 31 and a plurality of peripheral electrodes 27b electrically connected to the respective contact electrodes 34a, wherein the wafer 1 is interposed between the probe sheet 34 and the supporting member 33 via the probe sheet 31 by reducing pressure through vacuuming, and the contact terminals 7 are contacted to the electrodes 3 of the wafer 1 at a desired atmospheric pressure, thereby performing the inspection. The contact terminals 7 are formed to have a pyramidal or truncated pyramidal shape, and the probe sheet 34 is backed by a metal film 30b.