公开(公告)号：US08314624B2

公开(公告)日：2012-11-20

申请号：US13072235

申请日：2011-03-25

Applicant: Susumu Kasukabe ,  Naoki Okamoto

Inventor： Susumu Kasukabe ,  Naoki Okamoto

IPC: G01R31/00

CPC classification number: G01R31/2889 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2875

Abstract: A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely.

Abstract translation: 粘结并固定在探针片的背面上的框架，以围绕在其探测侧的探针片的中心区域共同形成的金字塔状或截头棱锥形的接触端子的一组突出， 多层布线板，并且通过具有弹簧特性的多个引导销在框架和中心部分处施加按压力，以便精细地倾斜。

公开(公告)号：US20090212798A1

公开(公告)日：2009-08-27

申请号：US12253271

申请日：2008-10-17

Applicant: Susumu KASUKABE ,  Yasunori Narizuka

Inventor： Susumu KASUKABE ,  Yasunori Narizuka

IPC: G01R1/073 ,  G01R3/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07378 ,  Y10T29/49204

Abstract: A silicon substrate is used as a mold, and thin films such as metal films and polyimide films are sequentially stacked on the silicon substrate by using photolithography techniques, thereby forming a probe sheet having contact terminals having a pyramidal shape or a truncated pyramidal shape disposed at distal ends of cantilever beam structures. A fixing substrate is further fixed to the probe sheet, and then, the formed probe sheet is sequentially stacked and formed on the silicon substrate, the substrate is fixed, and the silicon substrate and predetermined polyimide films are removed by etching, thereby forming the group of contact terminals with the cantilever beam structures at a time.

Abstract translation: 使用硅衬底作为模具，并且通过使用光刻技术将诸如金属膜和聚酰亚胺膜的薄膜依次堆叠在硅衬底上，从而形成具有接触端子的探针片，该接触端子具有锥形或截锥形形状 悬臂梁结构的末端。 将固定基板进一步固定在探针片上，然后将形成的探针片依次层叠并形成在硅基片上，固定基片，通过蚀刻除去硅基片和预定的聚酰亚胺膜，从而形成基片 的接触端子与悬臂梁结构一次。

公开(公告)号：US20070279074A1

公开(公告)日：2007-12-06

申请号：US11572033

申请日：2005-07-14

Applicant: Susumu Kasukabe ,  Yasunori Narizuka

Inventor： Susumu Kasukabe ,  Yasunori Narizuka

IPC: G01R31/26 ,  G01R1/073 ,  H01L21/66

CPC classification number: G01R1/07314 ,  G01R31/2863 ,  G01R31/2886

Abstract: A full wafer inspection apparatus and a manufacturing method of a semiconductor device capable of collectively and precisely inspecting semiconductor elements formed on a wafer, while securing the positional accuracy of tip portions of contact terminals are provided. A probe cassette used in a semiconductor inspection apparatus includes: a probe sheet 31 having a plurality of contact terminals 7 which contact electrodes 3 of a wafer 1 and a plurality of contact bumps 20b electrically connected to respective contact terminals 7; and a probe sheet 34 having a plurality of contact electrodes 34a which contact the contact bumps 20b of the probe sheet 31 and a plurality of peripheral electrodes 27b electrically connected to the respective contact electrodes 34a, wherein the wafer 1 is interposed between the probe sheet 34 and the supporting member 33 via the probe sheet 31 by reducing pressure through vacuuming, and the contact terminals 7 are contacted to the electrodes 3 of the wafer 1 at a desired atmospheric pressure, thereby performing the inspection. The contact terminals 7 are formed to have a pyramidal or truncated pyramidal shape, and the probe sheet 34 is backed by a metal film 30b.

Abstract translation: 提供了一种确保接触端子的末端部分的位置精度的全晶片检查装置和能够共同且精确地检查在晶片上形成的半导体元件的半导体器件的制造方法。 在半导体检查装置中使用的探针盒包括：探针片31，其具有与晶片1的电极3接触的多个接触端子7和与各接触端子7电连接的多个接触凸块20b; 以及探针片34，其具有与探针片31的接触凸块20b接触的多个接触电极34a和电连接到各个接触电极341的多个周边电极27b，其中晶片1介于 探针片34和支撑部件33，通过抽真空降低压力，并且接触端子7以期望的大气压力与晶片1的电极3接触，从而进行检查。 接触端子7形成为具有金字塔形或截锥形的金字塔形状，探针片34由金属膜30b支承。

公开(公告)号：US07285430B2

公开(公告)日：2007-10-23

申请号：US10873168

申请日：2004-06-23

Applicant: Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

Inventor： Susumu Kasukabe ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC: G01R31/26

CPC classification number: G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

Abstract: To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multiplayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multiplayer film. A clamping member is provided on the frame to make the multiplayer film project out to eliminate slack in the multiplayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

Abstract translation: 为了在连接装置和测试器之间实现电信号的高速交换，提供了一种用于支撑连接装置的支撑构件，多个尖端接触端子被排列在探测侧的区域中，提供了一种多层膜，其具有 电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多人膜的后侧。 夹持构件设置在框架上以使多人影片投射出来以消除多人影片中的松弛。 提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。 提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。

公开(公告)号：US07219422B2

公开(公告)日：2007-05-22

申请号：US10765917

申请日：2004-01-29

Applicant: Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

Inventor： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

IPC: H05K3/00 ,  H01R9/00

CPC classification number: G01R1/07314 ,  G01R31/2872 ,  Y10T29/41 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

Abstract: The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.

Abstract translation: 半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成 待测 在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。 通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。

公开(公告)号：US07049837B2

公开(公告)日：2006-05-23

申请号：US10676609

申请日：2003-10-02

Applicant: Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akio Hasebe

Inventor： Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akio Hasebe

IPC: G01R31/02

CPC classification number: G01R1/06744 ,  G01R1/06711 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2874 ,  H01L24/05 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01033

Abstract: A probe card has first contact terminals electrically connected to the fine-pitch electrodes of a test target; wirings drawn from the first contact terminals; and second contact terminals electrically connected to the wirings, wherein the first contact terminals are formed each using an anisotropically etched hole in a crystalline substrate, and a semiconductor device test method (fabrication method) using the probe card.

Abstract translation: 探针卡具有电连接到测试对象的细间距电极的第一接触端子; 从第一接触端子抽出的接线; 以及电连接到所述布线的第二接触端子，其中，使用所述探针卡的半导体器件测试方法（制造方法）在所述晶体衬底中各自使用各向异性蚀刻的孔来形成所述第一接触端子。

公开(公告)号：US06900646B2

公开(公告)日：2005-05-31

申请号：US10119077

申请日：2002-04-10

Applicant: Susumu Kasukabe ,  Akio Hasebe

Inventor： Susumu Kasukabe ,  Akio Hasebe

IPC: G01R31/26 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/66 ,  H05K3/40 ,  G01R31/02

CPC classification number: H05K3/4007 ,  G01R1/06738 ,  G01R1/0735 ,  G01R3/00

Abstract: A probing device for electrically contacting with a plurality of electrodes 3, 6 aligned on an object 1 to be tested so as to transfer electrical signal therewith, comprising: a wiring sheet being formed by aligning a plurality of contact electrodes 21, 110b, corresponding to each of said electrodes, each being planted with projecting probes 20, 110a covered with hard metal films on basis of a conductor thin film 41 formed on one surface of an insulator sheet 22 of a polyimide film by etching thereof, while extension wiring 23, 110c for electrically connecting to said each of said contact electrodes being formed on basis of a conductor thin film formed on either said one surface or the other surface opposing thereto of said insulator sheet of the polyimide film; and means for giving contacting pressure for obtaining electrical conduction between said extension wiring and said object to be tested by contacting tips of said projecting contact probe formed onto said each contact electrode through giving pressuring force between said wiring sheet and said object to be tested.

Abstract translation: 一种探针装置，用于与被测试物体1上对准的多个电极3,6电接触以便与其传输电信号，包括：布线板，其通过将多个接触电极21,110b对准而形成， 在每个所述电极上，每个被埋设有用硬金属膜覆盖的突出探针20,110a，该导电薄膜基于通过其蚀刻形成在聚酰亚胺膜的绝缘片22的一个表面上的导体薄膜41，而延伸布线23 ，110c，用于电连接到所述每个所述接触电极，所述接触电极基于形成在与所述聚酰亚胺膜的所述绝缘片相对的所述一个表面或另一表面上的导体薄膜形成; 以及用于通过在所述布线板和所述被测试物体之间施加加压力而使形成在所述每个接触电极上的所述突出接触探针的尖端接触，以提供接触压力以获得所述延伸布线和待测试物体之间的导电的装置。

公开(公告)号：US06197603B1

公开(公告)日：2001-03-06

申请号：US09157153

申请日：1998-09-18

Applicant: Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

Inventor： Ryuji Kohno ,  Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiko Ariga ,  Yuji Wada ,  Naoto Ban ,  Shuji Shibuya ,  Yasuhiro Motoyama ,  Kunio Matsumoto ,  Susumu Kasukabe ,  Terutaka Mori ,  Hidetaka Shigi ,  Takayoshi Watanabe

IPC: G01R3126

CPC classification number: G01R3/00 ,  G01R1/0735

Abstract: Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.

Abstract translation: 即使当大量区域中的多个探针通过将设置在膜中的探针压在晶片上时，通过将压力负载施加到多个位置的平面上的多个位置，负载的分散也可以保持在预定容限内 在探针测试步骤中与晶片相对的一侧的压力构件，代表典型的半导体器件制造步骤的老化测试步骤。 因此，可以提供通过同时探测大量集成电路或大尺寸集成电路来提高半导体器件的可靠性和生产率的半导体器件及其制造方法。

公开(公告)号：US07724006B2

公开(公告)日：2010-05-25

申请号：US12253271

申请日：2008-10-17

Applicant: Susumu Kasukabe ,  Yasunori Narizuka

Inventor： Susumu Kasukabe ,  Yasunori Narizuka

IPC: G01R31/02 ,  G01R31/26

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07378 ,  Y10T29/49204

Abstract: A silicon substrate is used as a mold, and thin films such as metal films and polyimide films are sequentially stacked on the silicon substrate by using photolithography techniques, thereby forming a probe sheet having contact terminals having a pyramidal shape or a truncated pyramidal shape disposed at distal ends of cantilever beam structures. A fixing substrate is further fixed to the probe sheet, and then, the formed probe sheet is sequentially stacked and formed on the silicon substrate, the substrate is fixed, and the silicon substrate and predetermined polyimide films are removed by etching, thereby forming the group of contact terminals with the cantilever beam structures at a time.

Abstract translation: 使用硅衬底作为模具，并且通过使用光刻技术将诸如金属膜和聚酰亚胺膜的薄膜依次堆叠在硅衬底上，从而形成具有接触端子的探针片，该接触端子具有锥形或截锥形形状 悬臂梁结构的末端。 将固定基板进一步固定在探针片上，然后将形成的探针片依次层叠并形成在硅基片上，固定基片，通过蚀刻除去硅基片和预定的聚酰亚胺膜，从而形成基片 的接触端子与悬臂梁结构一次。

公开(公告)号：US20090209053A1

公开(公告)日：2009-08-20

申请号：US12408000

申请日：2009-03-20

Applicant: Susumu KASUKABE ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

Inventor： Susumu KASUKABE ,  Terutaka Mori ,  Akihiko Ariga ,  Hidetaka Shigi ,  Takayoshi Watanabe ,  Ryuji Kono

IPC: H01L21/66

CPC classification number: G01R31/2889 ,  G01R1/06744 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863

Abstract: To achieve high speed exchange of electrical signals between a connection device and a tester, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multilayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multilayer film. A clamping member is provided on the frame to make the multilayer film project out to eliminate slack in the multilayer film. A contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member. A compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

Abstract translation: 为了在连接装置和测试器之间实现电信号的高速交换，提供支撑构件以支撑连接装置，多个尖端接触端子排列在探测侧的区域中，提供多层膜，其具有 电连接到接触端子的多个引出线和包围绝缘层的接地层，并且框架被夹持在多层膜的后侧。 在框架上设置夹紧构件以使多层膜突出以消除多层膜中的松弛。 提供接触压力装置，用于使接触端子的尖端以预定的从支撑构件到夹紧构件的接触压力接触每个电极。 提供了一种符合机构，使得尖端表面的接触端子组与电极组端子表面平行地排列，使得接触端子的尖端以相等的压力接触电极的表面。