发明申请
- 专利标题： Microelectromechanical Systems Encapsulation Process with Anti-Stiction Coating
- 专利标题（中）： 具有抗静电涂层的微机电系统封装工艺
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申请号： US11844844申请日： 2007-08-24
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公开(公告)号： US20080050861A1公开(公告)日： 2008-02-28
- 发明人: Cyril Vancura , Markus Ulm , Brian Stark , Matthias Metz , Tino Fuchs , Franz Laermer , Silvia Kronmueller
- 申请人： Cyril Vancura , Markus Ulm , Brian Stark , Matthias Metz , Tino Fuchs , Franz Laermer , Silvia Kronmueller
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.