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    Anti-stiction technique for electromechanical systems and electromechanical device employing same
    8.
    发明申请
    Anti-stiction technique for electromechanical systems and electromechanical device employing same 有权

    公开(公告)号：US20060246631A1

    公开(公告)日：2006-11-02

    申请号：US11115828

    申请日：2005-04-27

    申请人： Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

    发明人： Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

    IPC分类号： H01L21/44

    CPC分类号： B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

    Method of producing a device
    9.
    发明授权
    Method of producing a device 有权
    制造装置的方法

    公开(公告)号：US08020266B2

    公开(公告)日：2011-09-20

    申请号：US12172369

    申请日：2008-07-14

    申请人： Markus Ulm ,  Brian Stark ,  Matthias Metz

    发明人： Markus Ulm ,  Brian Stark ,  Matthias Metz

    IPC分类号： H01G7/00

    CPC分类号： B60C23/0411 ,  H01L41/1136 ,  H01L41/331 ,  H01L41/43 ,  H02N2/186 ,  H02N2/22 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49007 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T29/49224

    摘要： Methods of making an energy harvesting device are described. A case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.

    摘要翻译： 描述了制造能量收集装置的方法。 通过印刷成型方法注射成型方法产生用于从感测环境收集振动能的壳体和集成压电悬臂。 悬臂装置由压电材料构件和与压电构件耦合的高密度材料的检验质量组成。 印刷形成方法用于构建装置的基底和壁以及压电构件的中性层。 印刷金属层以形成压电元件的电极层和器件的电接触部分。 无源元件也可以形成为器件层的一部分。 整个组件可以封装在塑料中。

    Microelectromechanical devices and fabrication methods
    10.
    发明授权
    Microelectromechanical devices and fabrication methods 有权
    微机电装置及制造方法

    公开(公告)号：US07671515B2

    公开(公告)日：2010-03-02

    申请号：US11594525

    申请日：2006-11-07

    申请人： Matthias Metz ,  Zhiyu Pan ,  Brian Stark ,  Markus Ulm ,  Gary Yama

    发明人： Matthias Metz ,  Zhiyu Pan ,  Brian Stark ,  Markus Ulm ,  Gary Yama

    IPC分类号： H01L41/053

    CPC分类号： B81C1/00301 ,  B81B2207/015 ,  B81B2207/097 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.

    摘要翻译： 这里描述和说明了许多发明。 在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。 实施例还包括作为半导体感测结构的一部分的压电材料的位置。 结合压电材料的半导体感测结构可以用作感测装置以提供与感测到的事件相关联的输出信号。