发明申请
- 专利标题： Semiconductor Component Arrangement
- 专利标题（中）： 半导体元件布置
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申请号： US11851397申请日： 2007-09-07
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公开(公告)号： US20080061449A1公开(公告)日： 2008-03-13
- 发明人: Joachim Mahler , Thomas Behrens , Reimund Engl , Khalil Hosseini , Stefan Landau , Boris Plikat
- 申请人： Joachim Mahler , Thomas Behrens , Reimund Engl , Khalil Hosseini , Stefan Landau , Boris Plikat
- 申请人地址： DE Muenchen
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Muenchen
- 优先权： DE102006042032.2 20060907
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/66
摘要：
A semiconductor component arrangement having a semiconductor component, a mount, and an adhesive, wherein the adhesive connects the semiconductor component to the mount and the adhesive contains a marker substance. Also disclosed is a method for inspecting the connection of a semiconductor component to a mount. The semiconductor component is fixed on the mount using an adhesive, wherein the adhesive contains a marker substance, the mount with the semiconductor component is cleaned, and the mount is inspected for residues of the adhesive on the basis of radiation which is characteristic of the marker substance.
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