公开(公告)号：US20080061449A1

公开(公告)日：2008-03-13

申请号：US11851397

申请日：2007-09-07

申请人： Joachim Mahler ,  Thomas Behrens ,  Reimund Engl ,  Khalil Hosseini ,  Stefan Landau ,  Boris Plikat

发明人： Joachim Mahler ,  Thomas Behrens ,  Reimund Engl ,  Khalil Hosseini ,  Stefan Landau ,  Boris Plikat

IPC分类号： H01L23/12 ,  H01L21/66

CPC分类号： H01L23/12 ,  H01L24/83 ,  H01L2224/83 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor component arrangement having a semiconductor component, a mount, and an adhesive, wherein the adhesive connects the semiconductor component to the mount and the adhesive contains a marker substance. Also disclosed is a method for inspecting the connection of a semiconductor component to a mount. The semiconductor component is fixed on the mount using an adhesive, wherein the adhesive contains a marker substance, the mount with the semiconductor component is cleaned, and the mount is inspected for residues of the adhesive on the basis of radiation which is characteristic of the marker substance.

摘要翻译： 具有半导体部件，安装件和粘合剂的半导体部件布置，其中所述粘合剂将所述半导体部件连接到所述安装件，并且所述粘合剂包含标记物质。 还公开了一种用于检查半导体部件到安装座的连接的方法。 使用粘合剂将半导体部件固定在安装件上，其中粘合剂包含标记物质，清洁具有半导体部件的安装件，并且基于作为标记特征的辐射来检查安装件的粘合剂残留物 物质。

公开(公告)号：US20090093090A1

公开(公告)日：2009-04-09

申请号：US11867329

申请日：2007-10-04

申请人： Henrik Ewe ,  Stefan Landau ,  Klaus Schiess ,  Robert Bergmann ,  Alvin Wee Beng Tatt ,  Soon Lock Goh ,  Joachim Mahler ,  Boris Plikat ,  Reimund Engl

发明人： Henrik Ewe ,  Stefan Landau ,  Klaus Schiess ,  Robert Bergmann ,  Alvin Wee Beng Tatt ,  Soon Lock Goh ,  Joachim Mahler ,  Boris Plikat ,  Reimund Engl

IPC分类号： H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/24998 ,  H01L2224/32245 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.

摘要翻译： 公开了一种具有表面安装平坦的外部接触区域的功率半导体模块的制造方法。 至少一个功率半导体芯片由其后侧固定在漏极外部触点上。 绝缘层覆盖半导体芯片的侧边缘上方的顶侧，只要内壳平面离开半导体芯片的顶侧上的源极和栅极接触区域，并且还部分地释放出半导体芯片的顶侧 相应的外部联系人。

公开(公告)号：US07955901B2

公开(公告)日：2011-06-07

申请号：US11867329

申请日：2007-10-04

申请人： Henrik Ewe ,  Stefan Landau ,  Klaus Schiess ,  Robert Bergmann ,  Alvin Wee Beng Tatt ,  Soon Lock Goh ,  Joachim Mahler ,  Boris Plikat ,  Reimund Engl

发明人： Henrik Ewe ,  Stefan Landau ,  Klaus Schiess ,  Robert Bergmann ,  Alvin Wee Beng Tatt ,  Soon Lock Goh ,  Joachim Mahler ,  Boris Plikat ,  Reimund Engl

IPC分类号： H01L23/48

CPC分类号： H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/24998 ,  H01L2224/32245 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.

摘要翻译： 公开了一种具有表面安装平坦的外部接触区域的功率半导体模块的制造方法。 至少一个功率半导体芯片由其后侧固定在漏极外部触点上。 绝缘层覆盖半导体芯片的侧边缘上方的顶侧，只要内壳平面离开半导体芯片的顶侧上的源极和栅极接触区域，并且还部分地释放出半导体芯片的顶侧 相应的外部联系人。

公开(公告)号：US20130264721A1

公开(公告)日：2013-10-10

申请号：US13440478

申请日：2012-04-05

申请人： Stefan Landau ,  Joachim Mahler ,  Khalil Hosseini ,  Ivan Nikitin ,  Thomas Wowra ,  Lukas Ossowski

发明人： Stefan Landau ,  Joachim Mahler ,  Khalil Hosseini ,  Ivan Nikitin ,  Thomas Wowra ,  Lukas Ossowski

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/563 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/27436 ,  H01L2224/2902 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/321 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/73253 ,  H01L2224/73269 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： The electronic module includes a first carrier and a first semiconductor chip arranged on the first carrier. A second semiconductor chip is arranged above the first semiconductor chip. A material layer adheres the second semiconductor chip to the first carrier and encapsulates the first semiconductor chip.

摘要翻译： 电子模块包括第一载体和布置在第一载体上的第一半导体芯片。 第二半导体芯片布置在第一半导体芯片的上方。 材料层将第二半导体芯片粘附到第一载体并封装第一半导体芯片。

公开(公告)号：US20080067667A1

公开(公告)日：2008-03-20

申请号：US11755035

申请日：2007-05-30

申请人： Joachim Mahler ,  Stefan Landau ,  Eduard Knauer ,  Khalil Hosseini ,  Manfred Mengel

发明人： Joachim Mahler ,  Stefan Landau ,  Eduard Knauer ,  Khalil Hosseini ,  Manfred Mengel

IPC分类号： H01L23/08 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to a semiconductor device (1) comprising a semiconductor chip stack (2) and a plastic housing (3), and to methods for producing the semiconductor device (1). The semiconductor device (1) is constructed on a device carrier (4), on which a first semiconductor chip (5) is fixed by its rear side (6). At least one second semiconductor chip (8) is adhesively bonded by its rear side (9) on the top side (7) of the first semiconductor chip (5) by means of an adhesive layer (10). A second plastic composition (17) is arranged between a first plastic housing composition (11) of the plastic housing (3) and the edge sides (12, 13) of the adhesive layer and the edge sides (14, 15) of the second semiconductor chip (8) and also the top side (16) of the second semiconductor chip (8) in such a way that the first plastic housing composition (11) has no physical contact with the second semiconductor chip (8) and with the adhesive layer (10).

摘要翻译： 本发明涉及包括半导体芯片堆叠（2）和塑料外壳（3）的半导体器件（1）以及用于制造半导体器件（1）的方法。 半导体器件（1）构造在器件载体（4）上，第一半导体芯片（5）由其后侧（6）固定在该器件载体上。 至少一个第二半导体芯片（8）通过其粘合层（10）通过其后侧（9）在第一半导体芯片（5）的顶侧（7）上粘合。 第二塑料组合物（17）布置在塑料壳体（3）的第一塑料外壳组合物（11）和粘合剂层的边缘侧（12,13）之间，第二塑料组合物（17）的边缘侧（14,15） 半导体芯片（8）和第二半导体芯片（8）的顶侧（16），使得第一塑料外壳组合物（11）与第二半导体芯片（8）没有物理接触，并且与粘合剂 层（10）。

公开(公告)号：US20090079088A1

公开(公告)日：2009-03-26

申请号：US11858627

申请日：2007-09-20

申请人： Joachim Mahler ,  Thomas Behrens ,  Stefan Landau ,  Eduard Knauer ,  Rupert Fischer

发明人： Joachim Mahler ,  Thomas Behrens ,  Stefan Landau ,  Eduard Knauer ,  Rupert Fischer

IPC分类号： H01L23/12 ,  H01L21/58

CPC分类号： H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/2949 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00

摘要： A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.

摘要翻译： 半导体器件包括诸如引线框架的载体，半导体管芯和将半导体管芯固定到载体上的附接构件。 附着装置包括导电有机材料。

公开(公告)号：US07667337B2

公开(公告)日：2010-02-23

申请号：US11858627

申请日：2007-09-20

申请人： Joachim Mahler ,  Thomas Behrens ,  Stefan Landau ,  Eduard Knauer ,  Rupert Fischer

发明人： Joachim Mahler ,  Thomas Behrens ,  Stefan Landau ,  Eduard Knauer ,  Rupert Fischer

IPC分类号： H01L23/48

CPC分类号： H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/2949 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00

摘要： A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.

摘要翻译： 半导体器件包括诸如引线框架的载体，半导体管芯和将半导体管芯固定到载体上的附接构件。 附着装置包括导电有机材料。

公开(公告)号：US20130341780A1

公开(公告)日：2013-12-26

申请号：US13527668

申请日：2012-06-20

申请人： Thorsten Scharf ,  Boris Plikat ,  Henrik Ewe ,  Anton Prueckl ,  Stefan Landau

发明人： Thorsten Scharf ,  Boris Plikat ,  Henrik Ewe ,  Anton Prueckl ,  Stefan Landau

IPC分类号： H01L23/48 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/82 ,  H01L23/295 ,  H01L23/3171 ,  H01L23/3735 ,  H01L23/49562 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/2413 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29166 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/8382 ,  H01L2224/92244 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/15747 ,  H01L2924/00

摘要： A chip arrangement is provided. The chip arrangement including: a chip including at least one electrically conductive contact; a passivation material formed over the at least one electrically conductive contact; an encapsulation material formed over the passivation material; one or more holes formed through the encapsulation material and the passivation material, wherein the passivation material at least partially surrounds the one or more holes; and electrically conductive material provided within the one or more holes, wherein the electrically conductive material is electrically connected to the at least one electrically conductive contact.

摘要翻译： 提供了芯片布置。 芯片布置包括：包括至少一个导电触点的芯片; 形成在所述至少一个导电触点上的钝化材料; 形成在钝化材料上的封装材料; 通过所述封装材料和所述钝化材料形成的一个或多个孔，其中所述钝化材料至少部分地围绕所述一个或多个孔; 以及设置在所述一个或多个孔内的导电材料，其中所述导电材料电连接到所述至少一个导电触点。

公开(公告)号：US09953952B2

公开(公告)日：2018-04-24

申请号：US12195200

申请日：2008-08-20

申请人： Joachim Mahler ,  Michael Juerss ,  Stefan Landau

发明人： Joachim Mahler ,  Michael Juerss ,  Stefan Landau

IPC分类号： H01L23/34 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/564 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/28 ,  H01L24/29 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/4554 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73204 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/06 ,  H01L2924/00012 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device includes a carrier, a chip attached to the carrier, a sealant vapor deposited over the chip and the carrier, and encapsulation material deposited over the sealed chip and the sealed carrier.

公开(公告)号：US20130200502A1

公开(公告)日：2013-08-08

申请号：US13369075

申请日：2012-02-08

申请人： Ivan Nikitin ,  Stefan Landau ,  Joachim Mahler ,  Alexander Heinrich ,  Ralf Wombacher

发明人： Ivan Nikitin ,  Stefan Landau ,  Joachim Mahler ,  Alexander Heinrich ,  Ralf Wombacher

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/29 ,  H01L21/78

CPC分类号： H01L21/561 ,  B32B37/203 ,  B32B2305/342 ,  B32B2457/14 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82001 ,  H01L2224/83001 ,  H01L2224/92244 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/24246

摘要： A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer foil. The plurality of semiconductor chips adhered to the transfer foil is placed over a multi-device carrier. Heat is applied to laminate the transfer foil over the multi-device carrier, thereby accommodating the plurality of semiconductor chips between the laminated transfer foil and the multi-device carrier.

摘要翻译： 一种制造半导体器件的方法包括提供转印箔。 多个半导体芯片放置在转印箔上并粘附到转印箔上。 粘附到转印箔上的多个半导体芯片放置在多器件载体上。 施加热量以将转印箔层压在多器件载体上，从而在叠层转印箔和多器件载体之间容纳多个半导体芯片。