发明申请
- 专利标题: Integrated Circuit Comb Capacitor
- 专利标题(中): 集成电路梳状电容器
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申请号: US12034728申请日: 2008-02-21
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公开(公告)号: US20080130200A1公开(公告)日: 2008-06-05
- 发明人: Daniel C. Edelstein , Anil K. Chinthakindi , Timothy J. Dalton , Ebenezer E. Eshun , Jeffrey P. Gambino , Sarah L. Lane , Anthony K. Stamper
- 申请人: Daniel C. Edelstein , Anil K. Chinthakindi , Timothy J. Dalton , Ebenezer E. Eshun , Jeffrey P. Gambino , Sarah L. Lane , Anthony K. Stamper
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01G4/38
- IPC分类号: H01G4/38
摘要:
The invention is directed to an integrated circuit comb capacitor with capacitor electrodes that have an increased capacitance between neighboring capacitor electrodes as compared with other interconnects and via contacts formed in the same metal wiring level and at the same pitches. The invention achieves a capacitor that minimizes capacitance tolerance and preserves symmetry in parasitic electrode-substrate capacitive coupling, without adversely affecting other interconnects and via contacts formed in the same wiring level, through the use of, at most, one additional noncritical, photomask.
公开/授权文献
- US08120143B2 Integrated circuit comb capacitor 公开/授权日:2012-02-21
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