Invention Application
- Patent Title: SEMICONDUCTOR COMPONENT HAVING RECTIFYING JUNCTIONS AND METHOD FOR PRODUCING THE SAME
- Patent Title (中): 具有修整结的半导体元件及其制造方法
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Application No.: US12037269Application Date: 2008-02-26
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Publication No.: US20080203517A1Publication Date: 2008-08-28
- Inventor: MICHAEL RUEB , Roland Rupp , Michael Treu
- Applicant: MICHAEL RUEB , Roland Rupp , Michael Treu
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102007009227.1 20070226
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/822
Abstract:
A semiconductor component is proposed which has a semiconductor body having a first semiconductor zone of the first conduction type, at least one first rectifying junction with respect to the first semiconductor zone, at least one second rectifying junction with respect to the first semiconductor zone, wherein the three rectifying junctions each have a barrier height of different magnitude.
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