- 专利标题： ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME
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申请号： US12030260申请日： 2008-02-13
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公开(公告)号： US20080205024A1公开(公告)日： 2008-08-28
- 发明人: David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
- 申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H05K7/02
- IPC分类号： H05K7/02
摘要：
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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