公开(公告)号：US07732894B2

公开(公告)日：2010-06-08

申请号：US12030274

申请日：2008-02-13

申请人： David Questad ,  Vijayeshwar D. Khanna ,  Jennifer V. Muney ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit

发明人： David Questad ,  Vijayeshwar D. Khanna ,  Jennifer V. Muney ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit

IPC分类号： H01L23/48

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T428/24479 ,  H01L2224/0401 ,  H01L2924/00

摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

公开(公告)号：US20080205024A1

公开(公告)日：2008-08-28

申请号：US12030260

申请日：2008-02-13

申请人： David Questad ,  Vijayeshwar D. Khanna ,  Jennifer V. Muney ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit

发明人： David Questad ,  Vijayeshwar D. Khanna ,  Jennifer V. Muney ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit

IPC分类号： H05K7/02

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T428/24479 ,  H01L2224/0401 ,  H01L2924/00

摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

公开(公告)号：US08054630B2

公开(公告)日：2011-11-08

申请号：US12030260

申请日：2008-02-13

申请人： David Questad ,  Vijayeshwar D. Khanna ,  Jennifer V. Muney ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit

发明人： David Questad ,  Vijayeshwar D. Khanna ,  Jennifer V. Muney ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit

IPC分类号： H05K7/20

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T428/24479 ,  H01L2224/0401 ,  H01L2924/00

摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

摘要翻译： 将电子部件安装在基板上的方法包括在基板的表面中形成至少一个沟槽。 形成在衬底中的沟槽降低了衬底的刚度，这提供了较小的剪切阻力。 因此，沟槽减少了将电子部件安装到基板上的接头上的应变量，这增加了接头的寿命。

公开(公告)号：US20090085161A1

公开(公告)日：2009-04-02

申请号：US12030274

申请日：2008-02-13

申请人： David Questad ,  Vijayeshwar D. Khanna ,  Jennifer V. Muney ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit

发明人： David Questad ,  Vijayeshwar D. Khanna ,  Jennifer V. Muney ,  Arun Sharma ,  Sri M. Sri-Jayantha ,  Lorenzo Valdevit

IPC分类号： H01L29/00

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T428/24479 ,  H01L2224/0401 ,  H01L2924/00

摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

摘要翻译： 将电子部件安装在基板上的方法包括在基板的表面中形成至少一个沟槽。 形成在衬底中的沟槽降低了衬底的刚度，这提供了较小的剪切阻力。 因此，沟槽减少了将电子部件安装到基板上的接头上的应变量，这增加了接头的寿命。