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1.发明授权Elliptic C4 with optimal orientation for enhanced reliability in electronic packages 有权椭圆C4具有最佳的方向，增强电子封装的可靠性公开(公告)号：US07841508B2
公开(公告)日：2010-11-30
申请号：US11682082
申请日：2007-03-05
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K2101/40 , H01L23/49816 , H01L23/49838 , H01L24/16 , H01L2224/0401 , H01L2224/06051 , H01L2224/16225 , H01L2224/16227 , H01L2224/17051 , H01L2924/01004 , H01L2924/10253 , H05K1/111 , H05K3/3436 , H05K2201/09381 , H05K2201/094 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： A method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.
摘要翻译： 提供椭圆形C4连接的方法，其具有最佳取向以提高可靠性，这与其在电子封装中的安装有关。 在半导体芯片上的各种优选拐角位置处，基本上是椭圆形的焊盘或椭圆形的C 4焊盘配置。
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公开(公告)号：US07732894B2
公开(公告)日：2010-06-08
申请号：US12030274
申请日：2008-02-13
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H01L23/48
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US20080218990A1
公开(公告)日：2008-09-11
申请号：US12099381
申请日：2008-04-08
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H05K7/00
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US07777301B2
公开(公告)日：2010-08-17
申请号：US12099412
申请日：2008-04-08
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H01L23/48
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US07855430B2
公开(公告)日：2010-12-21
申请号：US12099381
申请日：2008-04-08
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H01L23/48
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
摘要翻译： 将电子部件安装在基板上的方法包括在基板的表面中形成至少一个沟槽。 形成在衬底中的沟槽降低了衬底的刚度，这提供了较小的剪切阻力。 因此，沟槽减少了将电子部件安装到基板上的接头上的应变量，这增加了接头的寿命。
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公开(公告)号：US20080205024A1
公开(公告)日：2008-08-28
申请号：US12030260
申请日：2008-02-13
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H05K7/02
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US08659119B2
公开(公告)日：2014-02-25
申请号：US12783787
申请日：2010-05-20
申请人： Vijayeshwar D. Kharma , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit , David Questad
发明人： Vijayeshwar D. Kharma , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit , David Questad
IPC分类号： H01L27/01
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.
摘要翻译： 一种电子模块，包括具有至少一个结构的衬底，该结构减少了通过衬底的应力流动，其中所述结构包括在衬底的表面中的至少一个沟槽。
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8.发明申请ELLIPTIC C4 WITH OPTIMAL ORIENTATION FOR ENHANCED RELIABILITY IN ELECTRONIC PACKAGES 有权具有电子包装增强可靠性的优化方向的ELLIPTIC C4公开(公告)号：US20110049711A1
公开(公告)日：2011-03-03
申请号：US12869340
申请日：2010-08-26
申请人： Sri M. Jayantha , Lorenzo Valdevit
发明人： Sri M. Jayantha , Lorenzo Valdevit
IPC分类号： H01L23/498
CPC分类号： B23K1/0016 , B23K2101/40 , H01L23/49816 , H01L23/49838 , H01L24/16 , H01L2224/0401 , H01L2224/06051 , H01L2224/16225 , H01L2224/16227 , H01L2224/17051 , H01L2924/01004 , H01L2924/10253 , H05K1/111 , H05K3/3436 , H05K2201/09381 , H05K2201/094 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.
摘要翻译： 用于配备具有椭圆形C4连接的电子封装的布置具有最佳取向以增强可靠性。 此外，公开了一种提供椭圆形C4连接的方法，其具有与其安装在电子封装中相关联的实现的用于增强可靠性的最佳取向。 在半导体芯片上的各种优选拐角位置处，基本上是椭圆形的焊盘或椭圆形的C 4焊盘配置。
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9.发明申请ELLIPTIC C4 WITH OPTIMAL ORIENTATION FOR ENHANCED RELIABILITY IN ELECTRONIC PACKAGES 有权具有电子包装增强可靠性的优化方向的ELLIPTIC C4公开(公告)号：US20080217384A1
公开(公告)日：2008-09-11
申请号：US11682082
申请日：2007-03-05
申请人： Sri M. Jayantha , Lorenzo Valdevit
发明人： Sri M. Jayantha , Lorenzo Valdevit
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K2101/40 , H01L23/49816 , H01L23/49838 , H01L24/16 , H01L2224/0401 , H01L2224/06051 , H01L2224/16225 , H01L2224/16227 , H01L2224/17051 , H01L2924/01004 , H01L2924/10253 , H05K1/111 , H05K3/3436 , H05K2201/09381 , H05K2201/094 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability, as implemented in connection with their installation in electronic packages. Employed are essentially elliptical solder pads or elliptical C4 pad configurations at various preferably corner locations on a semiconductor chip.
摘要翻译： 用于配备具有椭圆形C4连接的电子封装的布置具有最佳取向以增强可靠性。 此外，公开了一种提供椭圆形C4连接的方法，其具有与其安装在电子封装中相关联的实现的用于增强可靠性的最佳取向。 在半导体芯片上的各种优选拐角位置处，基本上是椭圆形的焊盘或椭圆形的C 4焊盘配置。
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10.发明授权公开(公告)号：US08054630B2
公开(公告)日：2011-11-08
申请号：US12030260
申请日：2008-02-13
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H05K7/20
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
摘要翻译： 将电子部件安装在基板上的方法包括在基板的表面中形成至少一个沟槽。 形成在衬底中的沟槽降低了衬底的刚度，这提供了较小的剪切阻力。 因此，沟槽减少了将电子部件安装到基板上的接头上的应变量，这增加了接头的寿命。
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