发明申请
US20080233301A1 STACKED-FILM-FORMING SYSTEM, SPUTTERING APPARATUS, AND METHOD FOR FORMING STACKED FILM
审中-公开
堆叠成膜系统,溅射装置和形成堆叠膜的方法
- 专利标题: STACKED-FILM-FORMING SYSTEM, SPUTTERING APPARATUS, AND METHOD FOR FORMING STACKED FILM
- 专利标题(中): 堆叠成膜系统,溅射装置和形成堆叠膜的方法
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申请号: US12041254申请日: 2008-03-03
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公开(公告)号: US20080233301A1公开(公告)日: 2008-09-25
- 发明人: Katsunori Takahashi , Yoichi Sato , Kazuya Takahashi
- 申请人: Katsunori Takahashi , Yoichi Sato , Kazuya Takahashi
- 申请人地址: JP Kawasaki-shi
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP Kawasaki-shi
- 优先权: JP2007-069900 20070319
- 主分类号: B05D1/36
- IPC分类号: B05D1/36 ; B05C13/00 ; C23C16/00 ; C23C14/00
摘要:
According to an aspect of an embodiment, a stacked-film-forming system for forming a stacked film has a first film-forming apparatus including a holder having a frame surrounding the substrate and a holding mechanism for holding the substrate inside the frame so that the major surface of the substrate is vertically oriented, a material emission portion for emitting a material of a first film toward the substrate held in the holder, and a shield being disposed between the holder and the material emission portion and shielding areas except for a portion of the frame from the emitted material. The portion is located at the upper part of the substrate. The stacked-film-forming system has a second film-forming apparatus for forming a second film, on the first film. The second film is made of a material different from the material of the first film.
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