发明申请
- 专利标题： PLASMA PROCESSING APPARATUS
- 专利标题（中）： 等离子体加工设备
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申请号： US11738505申请日： 2007-04-22
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公开(公告)号： US20080257261A1公开(公告)日： 2008-10-23
- 发明人: Hiroji Hanawa , Andrew Nguyen , Keiji Horiaka , Kallol Bera , Kenneth S. Collins , Lawrence Wong , Martin Jeff Salinas , Roger Alan Lindley , Hong S. Yang
- 申请人： Hiroji Hanawa , Andrew Nguyen , Keiji Horiaka , Kallol Bera , Kenneth S. Collins , Lawrence Wong , Martin Jeff Salinas , Roger Alan Lindley , Hong S. Yang
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H05H1/00
- IPC分类号： H05H1/00
摘要：
Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a plasma control magnet assembly includes a plurality of magnets arranged in a predetermined pattern that generate a magnetic field having a strength greater than 10 Gauss in a region proximate the assembly and less than 10 Gauss in a region remote from the assembly.
公开/授权文献
- US07972469B2 Plasma processing apparatus 公开/授权日：2011-07-05