Invention Application
US20080264684A1 Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same
审中-公开
用于发送电路的载体构件，使用载体构件的无芯印刷电路板及其制造方法
- Patent Title: Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same
- Patent Title (中): 用于发送电路的载体构件，使用载体构件的无芯印刷电路板及其制造方法
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Application No.: US12003669Application Date: 2007-12-28
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Publication No.: US20080264684A1Publication Date: 2008-10-30
- Inventor: Myung Sam Kang , Byoung Youl Min , Je Gwang Yoo , Jung Hyun Park , Chang Sup Ryu , Jin Yong Ahn
- Applicant: Myung Sam Kang , Byoung Youl Min , Je Gwang Yoo , Jung Hyun Park , Chang Sup Ryu , Jin Yong Ahn
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0042002 20070430
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H05K1/00 ; H05K1/11
Abstract:
Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.
Information query
