公开(公告)号：US20120073865A1

公开(公告)日：2012-03-29

申请号：US13311058

申请日：2011-12-05

申请人： Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

发明人： Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

IPC分类号： H05K1/09 ,  H05K1/00

CPC分类号： H05K3/428 ,  H05K3/205 ,  H05K3/383 ,  H05K3/384 ,  H05K3/4602 ,  H05K3/4658 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/1536 ,  Y10T29/49155

摘要： A carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.

摘要翻译： 用于发送电路的载体构件，其是具有嵌入其中的电路图案的无芯型印刷电路板的部件，并且其可用于通过仅在其下端形成突起来提供高密度和高可靠性的印刷电路板 电路图案，使用承载构件的无芯印刷电路板，以及制造载体构件和无芯非印刷电路板的方法。

公开(公告)号：US20080264684A1

公开(公告)日：2008-10-30

申请号：US12003669

申请日：2007-12-28

申请人： Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

发明人： Myung Sam Kang ,  Byoung Youl Min ,  Je Gwang Yoo ,  Jung Hyun Park ,  Chang Sup Ryu ,  Jin Yong Ahn

IPC分类号： H05K3/10 ,  H05K1/00 ,  H05K1/11

CPC分类号： H05K3/428 ,  H05K3/205 ,  H05K3/383 ,  H05K3/384 ,  H05K3/4602 ,  H05K3/4658 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/1536 ,  Y10T29/49155

摘要： Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.

摘要翻译： 本文公开了一种用于传输电路的载体构件，其是具有嵌入其中的电路图案的无芯印刷电路板的部件，其可用于通过仅在下部形成突起来提供高密度和高可靠性的印刷电路板 电路图案的端部，使用载体部件的无芯印刷电路板，以及制造载体部件和无芯印刷电路板的方法。

公开(公告)号：US20100024212A1

公开(公告)日：2010-02-04

申请号：US12588259

申请日：2009-10-08

申请人： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

发明人： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC分类号： H05K3/06 ,  H05K3/36 ,  H05K3/42

CPC分类号： H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

摘要翻译： 一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US07707715B2

公开(公告)日：2010-05-04

申请号：US12005610

申请日：2007-12-28

申请人： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

发明人： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC分类号： H05K3/00

CPC分类号： H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

摘要翻译： 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US20090056119A1

公开(公告)日：2009-03-05

申请号：US12005610

申请日：2007-12-28

申请人： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

发明人： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC分类号： H05K3/00

CPC分类号： H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

摘要翻译： 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US20080212299A1

公开(公告)日：2008-09-04

申请号：US11797084

申请日：2007-04-30

申请人： Tae Eui Kim ,  Byoung Youl Min ,  Myung Sam Kang ,  Je Gwang Yoo

发明人： Tae Eui Kim ,  Byoung Youl Min ,  Myung Sam Kang ,  Je Gwang Yoo

IPC分类号： H05K1/18 ,  H01R43/00

CPC分类号： H05K1/162 ,  H05K3/205 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/49169

摘要： Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.

摘要翻译： 公开了一种用于提高嵌入式电容器的容限的印刷电路板及其制造方法。 具有嵌入式电容器的印刷电路板通过将具有通过添加工艺形成的下电极的电路层转移并嵌入到树脂绝缘层中而被制造，从而在通常由蚀刻工艺引起的电路公差中被最小化，从而被应用于 电容器用于RF匹配。

公开(公告)号：US08022311B2

公开(公告)日：2011-09-20

申请号：US11797084

申请日：2007-04-30

申请人： Tae Eui Kim ,  Byoung Youl Min ,  Myung Sam Kang ,  Je Gwang Yoo

发明人： Tae Eui Kim ,  Byoung Youl Min ,  Myung Sam Kang ,  Je Gwang Yoo

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/205 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/49169

摘要： Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.

摘要翻译： 公开了一种用于提高嵌入式电容器的容限的印刷电路板及其制造方法。 具有嵌入式电容器的印刷电路板通过将具有通过添加工艺形成的下电极的电路层转移并嵌入到树脂绝缘层中而被制造，从而在通常由蚀刻工艺引起的电路容差中被最小化，从而被应用于 电容器用于RF匹配。

公开(公告)号：US07485569B2

公开(公告)日：2009-02-03

申请号：US11137345

申请日：2005-05-24

申请人： Chang Sup Ryu ,  Doo Hwan Lee ,  Jin Yong Ahn ,  Myung Sam Kang ,  Suk Hyeon Cho

发明人： Chang Sup Ryu ,  Doo Hwan Lee ,  Jin Yong Ahn ,  Myung Sam Kang ,  Suk Hyeon Cho

IPC分类号： H01L21/4763

CPC分类号： H01L23/5389 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/82039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0191

摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

摘要翻译： 一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层 并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。 此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

公开(公告)号：US20110061907A1

公开(公告)日：2011-03-17

申请号：US12654538

申请日：2009-12-22

申请人： Myung Sam Kang ,  Chang Sup Ryu

发明人： Myung Sam Kang ,  Chang Sup Ryu

IPC分类号： H05K1/09 ,  H05K1/11 ,  C25D5/02 ,  B32B38/00

CPC分类号： C25D5/022 ,  C25D7/12 ,  H05K3/0035 ,  H05K3/242 ,  H05K3/243 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/054 ,  H05K2203/0577 ,  H05K2203/1581

摘要： A printed circuit board according to an aspect of the invention may include: a board portion having an electrode portion provided on a surface thereof; a solder resist layer provided on the surface of the board portion and having an opening therein to expose the electrode portion to the outside; and a bump layer having the same diameter as the opening and providing an electrical connection with an external chip component.

摘要翻译： 根据本发明的一个方面的印刷电路板可以包括：具有设置在其表面上的电极部分的板部分; 阻焊层，设置在基板部分的表面上，并且在其中具有开口以将电极部分暴露于外部; 以及具有与开口相同直径并且提供与外部芯片部件的电连接的凸块层。

公开(公告)号：US07583512B2

公开(公告)日：2009-09-01

申请号：US12023616

申请日：2008-01-31

申请人： Chang Sup Ryu ,  Myung Sam Kang

发明人： Chang Sup Ryu ,  Myung Sam Kang

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49101 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

摘要翻译： 公开了一种包括嵌入式无源元件的PCB及其制造方法。 PCB包括形成电路图案的至少两个电路层。 在电路层之间插入至少一个绝缘层。 一对端子通过绝缘层垂直地形成，镀有第一导电材料，并且彼此分开预定距离。 嵌入式无源部件插入在端子之间，并且具有形成在其两侧的电极。 电极与端子分开预定距离，并通过第二导电材料与端子电连接。