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1.发明申请Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same 审中-公开用于发送电路的载体构件，使用载体构件的无芯印刷电路板及其制造方法公开(公告)号：US20080264684A1
公开(公告)日：2008-10-30
申请号：US12003669
申请日：2007-12-28
申请人： Myung Sam Kang , Byoung Youl Min , Je Gwang Yoo , Jung Hyun Park , Chang Sup Ryu , Jin Yong Ahn
发明人： Myung Sam Kang , Byoung Youl Min , Je Gwang Yoo , Jung Hyun Park , Chang Sup Ryu , Jin Yong Ahn
CPC分类号： H05K3/428 , H05K3/205 , H05K3/383 , H05K3/384 , H05K3/4602 , H05K3/4658 , H05K2201/0394 , H05K2201/09563 , H05K2203/1536 , Y10T29/49155
摘要： Disclosed herein is a carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.
摘要翻译： 本文公开了一种用于传输电路的载体构件，其是具有嵌入其中的电路图案的无芯印刷电路板的部件，其可用于通过仅在下部形成突起来提供高密度和高可靠性的印刷电路板 电路图案的端部，使用载体部件的无芯印刷电路板，以及制造载体部件和无芯印刷电路板的方法。
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2.发明申请CARRIER MEMBER FOR TRANSMITTING CIRCUITS, CORELESS PRINTED CIRCUIT BOARD USING THE CARRIER MEMBER, AND METHOD OF MANUFACTURING THE SAME 审中-公开用于发送电路的载波组件，使用载波成员的无缝印刷电路板及其制造方法公开(公告)号：US20120073865A1
公开(公告)日：2012-03-29
申请号：US13311058
申请日：2011-12-05
申请人： Myung Sam Kang , Byoung Youl Min , Je Gwang Yoo , Jung Hyun Park , Chang Sup Ryu , Jin Yong Ahn
发明人： Myung Sam Kang , Byoung Youl Min , Je Gwang Yoo , Jung Hyun Park , Chang Sup Ryu , Jin Yong Ahn
CPC分类号： H05K3/428 , H05K3/205 , H05K3/383 , H05K3/384 , H05K3/4602 , H05K3/4658 , H05K2201/0394 , H05K2201/09563 , H05K2203/1536 , Y10T29/49155
摘要： A carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board.
摘要翻译： 用于发送电路的载体构件，其是具有嵌入其中的电路图案的无芯型印刷电路板的部件，并且其可用于通过仅在其下端形成突起来提供高密度和高可靠性的印刷电路板 电路图案，使用承载构件的无芯印刷电路板，以及制造载体构件和无芯非印刷电路板的方法。
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公开(公告)号：US07707715B2
公开(公告)日：2010-05-04
申请号：US12005610
申请日：2007-12-28
申请人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
发明人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
IPC分类号： H05K3/00
CPC分类号： H05K3/205 , H05K3/062 , H05K3/108 , H05K3/462 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/061 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
摘要翻译： 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。
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公开(公告)号：US20090056119A1
公开(公告)日：2009-03-05
申请号：US12005610
申请日：2007-12-28
申请人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
发明人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
IPC分类号： H05K3/00
CPC分类号： H05K3/205 , H05K3/062 , H05K3/108 , H05K3/462 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/061 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
摘要翻译： 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。
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公开(公告)号：US20100024212A1
公开(公告)日：2010-02-04
申请号：US12588259
申请日：2009-10-08
申请人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
发明人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
CPC分类号： H05K3/205 , H05K3/062 , H05K3/108 , H05K3/462 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/061 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
摘要翻译： 一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。
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6.发明授权Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same 有权用于提高嵌入式电容器容差的印刷电路板及其制造方法公开(公告)号：US08022311B2
公开(公告)日：2011-09-20
申请号：US11797084
申请日：2007-04-30
申请人： Tae Eui Kim , Byoung Youl Min , Myung Sam Kang , Je Gwang Yoo
发明人： Tae Eui Kim , Byoung Youl Min , Myung Sam Kang , Je Gwang Yoo
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K3/205 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/09672 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165 , Y10T29/49169
摘要： Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.
摘要翻译： 公开了一种用于提高嵌入式电容器的容限的印刷电路板及其制造方法。 具有嵌入式电容器的印刷电路板通过将具有通过添加工艺形成的下电极的电路层转移并嵌入到树脂绝缘层中而被制造，从而在通常由蚀刻工艺引起的电路容差中被最小化，从而被应用于 电容器用于RF匹配。
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7.发明申请Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same 有权用于提高嵌入式电容器容差的印刷电路板及其制造方法公开(公告)号：US20080212299A1
公开(公告)日：2008-09-04
申请号：US11797084
申请日：2007-04-30
申请人： Tae Eui Kim , Byoung Youl Min , Myung Sam Kang , Je Gwang Yoo
发明人： Tae Eui Kim , Byoung Youl Min , Myung Sam Kang , Je Gwang Yoo
CPC分类号： H05K1/162 , H05K3/205 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/09672 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165 , Y10T29/49169
摘要： Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.
摘要翻译： 公开了一种用于提高嵌入式电容器的容限的印刷电路板及其制造方法。 具有嵌入式电容器的印刷电路板通过将具有通过添加工艺形成的下电极的电路层转移并嵌入到树脂绝缘层中而被制造，从而在通常由蚀刻工艺引起的电路公差中被最小化，从而被应用于 电容器用于RF匹配。
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公开(公告)号：US20080000680A1
公开(公告)日：2008-01-03
申请号：US11819925
申请日：2007-06-29
申请人： Suk Hyeon Cho , Byoung Youl Min , Je Gwang Yoo , Hae Nam Seo , Byung Moon Kim , Ji Hong Jo , Han Seo Cho
发明人： Suk Hyeon Cho , Byoung Youl Min , Je Gwang Yoo , Hae Nam Seo , Byung Moon Kim , Ji Hong Jo , Han Seo Cho
IPC分类号： H05K1/03
CPC分类号： H05K1/0206 , H01L23/3735 , H01L23/5389 , H01L24/25 , H01L24/82 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/82039 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/14 , H01L2924/3025 , H05K1/0204 , H05K1/185 , H05K3/06 , H05K3/4038 , H05K3/4602 , H05K3/4647 , H05K3/4652 , H05K2201/09509 , H05K2201/096 , H05K2203/0733 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same, which can achieve reliable heat resistance because heat radiation characteristics are improved, and processing costs of which are reduced because processing times are shortened.
摘要翻译： 这里公开了一种印刷电路板及其制造方法，其可以提高热辐射特性，从而可以实现可靠的耐热性，并且由于加工时间缩短，其加工成本降低。
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公开(公告)号：US20090308650A1
公开(公告)日：2009-12-17
申请号：US12222176
申请日：2008-08-04
申请人： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
发明人： Eung Suek Lee , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jun Heyoung Park , Jee Soo Mok
CPC分类号： H05K3/4069 , B82Y10/00 , H05K3/1291 , H05K3/4647 , H05K2201/026 , H05K2201/0323 , H05K2201/0355 , H05K2201/09827 , H05K2203/1126 , Y10T29/49155
摘要： The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved.
摘要翻译： 使用在含有碳纳米管的可燃性糊料在第一金属层上形成凸块的方法，在第一金属层上焙烧包括凸块的第一金属层，形成绝缘层和第二金属层，制造印刷电路板， 并且对第一和第二金属层进行图案化，由此降低了印刷电路板的电阻率，提高了导电性和冷却性能。
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公开(公告)号：US20100230146A1
公开(公告)日：2010-09-16
申请号：US12544959
申请日：2009-08-20
申请人： Eung Suek LEE , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jee Soo Mok
发明人： Eung Suek LEE , Je Gwang Yoo , Chang Sup Ryu , Jun Oh Hwang , Jee Soo Mok
CPC分类号： H05K3/108 , B82Y10/00 , C23C18/38 , C25D5/022 , C25D5/10 , C25D9/08 , H05K3/249 , H05K2201/026 , H05K2201/0347 , H05K2203/135
摘要： Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.
摘要翻译： 本发明公开了一种电路层，其包括在绝缘层上形成的化学镀铜层的CNT和沉积在化学镀铜层上的CNT层，因此电路层具有优异的电性能。
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