发明申请
- 专利标题： CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDUCTOR DEVICE, AND SURFACE LAMINATION STRUCTURE FOR CIRCUIT MEMBER
- 专利标题（中）： 电路构件，电路构件的制造方法，半导体器件和电路构件的表面层叠结构
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申请号： US11912163申请日： 2006-04-26
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公开(公告)号： US20090039486A1公开(公告)日： 2009-02-12
- 发明人: Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
- 申请人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
- 优先权： JP2005-128259 20050426
- 国际申请： PCT/JP2006/308721 WO 20060426
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H05K3/10 ; H05K3/30
摘要：
A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.