公开(公告)号：US20100325885A1

公开(公告)日：2010-12-30

申请号：US12878137

申请日：2010-09-09

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H05K3/10

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US20090146280A1

公开(公告)日：2009-06-11

申请号：US12095014

申请日：2006-11-28

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495 ,  C23F1/00

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member 20 includes a lead frame material 1 having a die pad 3, a lead part 6 to be electrically connected with a semiconductor chip 30, and an outer frame 2 configured to support the die pad and the lead part. The lead frame material includes a resin sealing region 9. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer 12A formed by laminating a Ni plated layer 13 and a Pd plated layer 14 in this order or a three-layer plated layer 12B formed by laminating the Ni plated layer 13, the Pd plated layer 14 and an Au plated layer 15 in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件20包括具有管芯焊盘3的引线框架材料1，与半导体芯片30电连接的引线部分6和被配置为支撑管芯焊盘和引线部分的外框架2。 引线框架材料包括树脂密封区域9.在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm或更大的粗化面10A至10C和11A至11C。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层13和Pd镀层14而形成的双层镀层12A，或通过层压Ni镀层13，Pd镀层14和镀Au的三层镀层12B 层15以此顺序形成在引线框架材料的整个表面上。

公开(公告)号：US08739401B2

公开(公告)日：2014-06-03

申请号：US12878137

申请日：2010-09-09

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H05K3/10

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

公开(公告)号：US08420446B2

公开(公告)日：2013-04-16

申请号：US13012268

申请日：2011-01-24

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L21/58

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件包括具有管芯焊盘的引线框架材料，与半导体芯片电连接的引线部分和被配置为支撑管芯焊盘和引线部分的外部框架。 引线框架材料包括树脂密封区域。 在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm以上的粗糙面。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层和Pd镀层而形成的双层镀层，或者依次层叠Ni镀层，Pd镀层和Au镀层而形成的三层镀层 在引线框架材料的整个表面上。

公开(公告)号：US20110117704A1

公开(公告)日：2011-05-19

申请号：US13012268

申请日：2011-01-24

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L21/58

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件包括具有管芯焊盘的引线框架材料，与半导体芯片电连接的引线部分和被配置为支撑管芯焊盘和引线部分的外部框架。 引线框架材料包括树脂密封区域。 在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm以上的粗化面10A〜10C和11A〜11C。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层和Pd镀层而形成的双层镀层，或者依次层叠Ni镀层，Pd镀层和Au镀层而形成的三层镀层 在引线框架材料的整个表面上。

公开(公告)号：US08742554B2

公开(公告)日：2014-06-03

申请号：US11912163

申请日：2006-04-26

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US20090039486A1

公开(公告)日：2009-02-12

申请号：US11912163

申请日：2006-04-26

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495 ,  H05K3/10 ,  H05K3/30

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US07548172B2

公开(公告)日：2009-06-16

申请号：US10515335

申请日：2003-06-03

申请人： Akira Shinada ,  Kenji Matsumura

发明人： Akira Shinada ,  Kenji Matsumura

IPC分类号： G08G1/16 ,  G02B26/00

CPC分类号： G08G1/164 ,  B60Q1/50 ,  G08G1/092 ,  G08G1/096783 ,  G08G1/161

摘要： The present invention is directed to vehicle communication equipment capable of transferring information using light without adding new light emitting means, and further, between a stationary apparatus and a vehicle or between vehicles. A light emitted from a signal lamp (11) of a stationarily installed traffic signal (10) or a head lamp (35) or a tail lamp (36) of a vehicle (20) is superimposed with a signal by a modulator (13), the modulated light is received by a light receiving unit (21) of the vehicle (20) side, and the received modulated light is demodulated by a decoder (22) to be displayed on a display panel (24).

摘要翻译： 本发明涉及能够在不添加新的发光装置的情况下进行信息传送的车辆通信装置，并且还涉及在固定装置与车辆之间或车辆之间。 从固定安装的交通信号灯（10）或车辆（20）的前灯（35）或尾灯（36）的信号灯（11）发出的光与调制器（13）的信号叠加， 调制光被车辆（20）侧的光接收单元（21）接收，并且接收到的调制光由解码器（22）解调以显示在显示面板（24）上。

公开(公告)号：US20070141032A1

公开(公告)日：2007-06-21

申请号：US11362803

申请日：2006-02-28

申请人： Kenji Matsumura ,  Yoshiki Takashima ,  Shinya Kimura

发明人： Kenji Matsumura ,  Yoshiki Takashima ,  Shinya Kimura

IPC分类号： A01N63/04

CPC分类号： A01N63/04 ,  A01N25/04

摘要： The present invention provides an insecticidal oil-based formulation, which comprises a petroleum hydrocarbon oil, a nonionic surfactant suitable for emulsifying the petroleum hydrocarbon oil, a desiccating agent and an insecticidal filamentous fungus; and a method for controlling insect pests, which comprises applying said formulation to an insect pests, a habitat of the insect pest or a plant vulnerable to the insect pest; and the like.

摘要翻译： 本发明提供一种杀虫油性制剂，其包含石油烃油，适用于乳化石油烃油的非离子表面活性剂，干燥剂和杀虫丝状真菌; 以及一种防治害虫的方法，其中包括将所述制剂应用于害虫，昆虫害虫栖息地或易受虫害害虫害虫害的植物; 等等。

公开(公告)号：US06884607B2

公开(公告)日：2005-04-26

申请号：US10004115

申请日：2001-12-06

申请人： Hiroyuki Asako ,  Kenji Matsumura ,  Masatoshi Shimizu ,  Nobuya Itoh ,  Ryuhei Wakita

发明人： Hiroyuki Asako ,  Kenji Matsumura ,  Masatoshi Shimizu ,  Nobuya Itoh ,  Ryuhei Wakita

IPC分类号： C12N1/21 ,  C12N9/04 ,  C12N15/53 ,  C12P7/42 ,  C12P7/62 ,  C12P13/00 ,  C12N9/02 ,  C12N15/52 ,  C07N21/04

CPC分类号： C12N9/0006 ,  C12P7/42 ,  C12P7/62 ,  C12P13/002

摘要： There are provided a polynucleotide sequence coding for an amino acid sequence capable of preferentially producing (S)-4-bromo-3-hydroxy-butanoate by asymmetrically reducing 4-bromo-3-oxobutanoate, A DNA construct having a promoter in operative linkage with the polynucleotide sequence, a recombinant vector containing the polynucleotide sequence, a transformant, a recombinant vector and the like.

摘要翻译： 提供了编码能够通过不对称还原4-溴-3-氧代丁酸酯优先产生（S）-4-溴-3-羟基丁酸酯的氨基酸序列的多核苷酸序列，具有与 多核苷酸序列，含有多核苷酸序列的重组载体，转化体，重组载体等。