公开(公告)号：US20090146280A1

公开(公告)日：2009-06-11

申请号：US12095014

申请日：2006-11-28

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495 ,  C23F1/00

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member 20 includes a lead frame material 1 having a die pad 3, a lead part 6 to be electrically connected with a semiconductor chip 30, and an outer frame 2 configured to support the die pad and the lead part. The lead frame material includes a resin sealing region 9. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer 12A formed by laminating a Ni plated layer 13 and a Pd plated layer 14 in this order or a three-layer plated layer 12B formed by laminating the Ni plated layer 13, the Pd plated layer 14 and an Au plated layer 15 in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件20包括具有管芯焊盘3的引线框架材料1，与半导体芯片30电连接的引线部分6和被配置为支撑管芯焊盘和引线部分的外框架2。 引线框架材料包括树脂密封区域9.在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm或更大的粗化面10A至10C和11A至11C。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层13和Pd镀层14而形成的双层镀层12A，或通过层压Ni镀层13，Pd镀层14和镀Au的三层镀层12B 层15以此顺序形成在引线框架材料的整个表面上。

公开(公告)号：US20100325885A1

公开(公告)日：2010-12-30

申请号：US12878137

申请日：2010-09-09

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H05K3/10

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US08739401B2

公开(公告)日：2014-06-03

申请号：US12878137

申请日：2010-09-09

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H05K3/10

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

公开(公告)号：US08420446B2

公开(公告)日：2013-04-16

申请号：US13012268

申请日：2011-01-24

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L21/58

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件包括具有管芯焊盘的引线框架材料，与半导体芯片电连接的引线部分和被配置为支撑管芯焊盘和引线部分的外部框架。 引线框架材料包括树脂密封区域。 在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm以上的粗糙面。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层和Pd镀层而形成的双层镀层，或者依次层叠Ni镀层，Pd镀层和Au镀层而形成的三层镀层 在引线框架材料的整个表面上。

公开(公告)号：US20110117704A1

公开(公告)日：2011-05-19

申请号：US13012268

申请日：2011-01-24

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L21/58

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件包括具有管芯焊盘的引线框架材料，与半导体芯片电连接的引线部分和被配置为支撑管芯焊盘和引线部分的外部框架。 引线框架材料包括树脂密封区域。 在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm以上的粗化面10A〜10C和11A〜11C。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层和Pd镀层而形成的双层镀层，或者依次层叠Ni镀层，Pd镀层和Au镀层而形成的三层镀层 在引线框架材料的整个表面上。

公开(公告)号：US08742554B2

公开(公告)日：2014-06-03

申请号：US11912163

申请日：2006-04-26

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US20090039486A1

公开(公告)日：2009-02-12

申请号：US11912163

申请日：2006-04-26

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495 ,  H05K3/10 ,  H05K3/30

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US09077938B2

公开(公告)日：2015-07-07

申请号：US13690729

申请日：2012-11-30

申请人： Hiroyuki Saito ,  Hiroshi Akita ,  Eri Yagi ,  Tomohiro Kawasaki

发明人： Hiroyuki Saito ,  Hiroshi Akita ,  Eri Yagi ,  Tomohiro Kawasaki

IPC分类号： H04N1/60 ,  G03G15/16

CPC分类号： H04N1/60 ,  G03G15/1605 ,  G03G15/169

摘要： An image forming apparatus includes a photosensitive drum, a developing device, a primary transfer part, a droplet ejecting unit and a controller. On the photosensitive drum, an electrostatic latent image is formed. The developing device forms a toner image by causing a developing agent to adhere to the electrostatic latent image. The primary transfer part transfers the toner image onto an intermediate transfer belt. The droplet ejecting unit ejects droplets onto the toner image on the photosensitive drum after forming the toner image on the photosensitive drum and before transferring the toner image to the transfer member. The controller controls an ejection area of the droplet ejecting unit in accordance with image information of the toner image.

摘要翻译： 图像形成装置包括感光鼓，显影装置，一次转印部分，液滴喷射单元和控制器。 在感光鼓上形成静电潜像。 显影装置通过使显影剂粘附到静电潜像来形成调色剂图像。 一次转印部分将调色剂图像转印到中间转印带上。 在形成感光鼓上的调色剂图像之后并且将调色剂图像转印到转印部件之前，液滴喷射单元将液滴喷射到感光鼓上的调色剂图像上。 控制器根据调色剂图像的图像信息控制液滴喷射单元的喷射区域。

公开(公告)号：US08807556B2

公开(公告)日：2014-08-19

申请号：US13529229

申请日：2012-06-21

申请人： Noriyuki Sugiyama ,  Hiroyuki Saito ,  Atsushi Ikeda ,  Yasuyuki Hirai ,  Noriko Sato ,  Masashi Ito ,  Fumie Kameyama

发明人： Noriyuki Sugiyama ,  Hiroyuki Saito ,  Atsushi Ikeda ,  Yasuyuki Hirai ,  Noriko Sato ,  Masashi Ito ,  Fumie Kameyama

IPC分类号： B65H3/52 ,  B65H3/66 ,  B65H3/34 ,  B65H3/06 ,  B65H3/56

CPC分类号： B65H3/0684 ,  B65H3/34 ,  B65H3/56 ,  B65H3/66 ,  B65H2301/4222 ,  B65H2403/512 ,  B65H2405/1134 ,  B65H2405/1136 ,  B65H2511/214 ,  B65H2511/416 ,  B65H2515/81 ,  B65H2220/01 ,  B65H2220/02 ,  B65H2220/11

摘要： Even in printing apparatus that make use of a plurality of kinds of sheets, the degradation of image quality is reduced. A sheet conveying apparatus includes: a sheet stacking unit; a sheet conveying unit being in contact with the sheet stacked on an uppermost portion, of the stacked sheets, and conveying the sheet; a separation unit separating the sheets into only one sheet of the uppermost portion by a separation slope that abuts a tip portion of the sheet conveyed by the sheet conveying unit; and a guide unit connected to the separation unit and guiding the sheet, in which an angle between the sheet stacking unit and the separation slope is switched to a first angle and a second angle smaller than the first angle by a rotation center of the separation unit provided in a vicinity of a connection portion of the separation unit and the guide unit.

摘要翻译： 即使在使用多种片材的打印装置中，也降低了图像质量的劣化。 片材输送装置包括：片材堆积单元; 片材输送单元与层叠在最上部的片材接触，并且输送片材; 分离单元，其通过与由所述片材输送单元输送的所述片材的前端部抵接的分离斜面将所述片材分离成仅一片最上部; 以及引导单元，其连接到分离单元并引导片材，其中片材积累单元和分离斜面之间的角度通过分离单元的旋转中心切换到第一角度和小于第一角度的第二角度 设置在分离单元和引导单元的连接部分附近。

公开(公告)号：US20130171601A1

公开(公告)日：2013-07-04

申请号：US13822828

申请日：2011-09-22

申请人： Shingo Yuasa ,  Hiroyuki Saito ,  Chiaki Yoshizuka

发明人： Shingo Yuasa ,  Hiroyuki Saito ,  Chiaki Yoshizuka

IPC分类号： G09B19/00

CPC分类号： G09B19/00 ,  A61B5/0059 ,  A61B5/1036 ,  A61B5/1114 ,  A61B5/1116 ,  A61B5/1122 ,  A61B5/744 ,  A61B2505/09 ,  G06F19/3481 ,  G06K9/00342 ,  G09B19/003 ,  G09B19/0038

摘要： The exercise assisting system includes: a display device including a display screen displaying an image to a user; a comparison image storing unit storing a comparison image representing an image of an exerciser performing a predetermined exercise; a comparison image display unit displaying the comparison image stored in the storing unit on the screen; a mirror image displaying means displaying a mirror image of the user so as to overlap the comparison image; a characteristic amount extraction unit detecting positions of sampling points of a body of the user and calculating a characteristic amount representing a posture of the user based on the position; a posture estimation unit comparing the characteristic amount from the extraction unit with a criterion amount representing a posture of the exerciser and estimating a deviation between postures of the user and the exerciser; and a presentation unit presenting an estimation result of the estimation unit.

摘要翻译： 该运动辅助系统包括：显示装置，包括向用户显示图像的显示屏幕; 比较图像存储单元，存储表示执行预定运动的锻炼者的图像的比较图像; 比较图像显示单元，显示存储在屏幕上的存储单元中的比较图像; 镜像显示装置，显示用户的镜像，以便与比较图像重叠; 特征量提取单元，其基于所述位置来检测用户身体的采样点的位置并计算表示所述用户的姿势的特征量; 姿势估计单元，将来自提取单元的特征量与表示锻炼者的姿势的标准量进行比较，并估计用户与锻炼者的姿势之间的偏差; 以及呈现所述估计单元的估计结果的呈现单元。