公开(公告)号：US20100325885A1

公开(公告)日：2010-12-30

申请号：US12878137

申请日：2010-09-09

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H05K3/10

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US20090146280A1

公开(公告)日：2009-06-11

申请号：US12095014

申请日：2006-11-28

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495 ,  C23F1/00

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member 20 includes a lead frame material 1 having a die pad 3, a lead part 6 to be electrically connected with a semiconductor chip 30, and an outer frame 2 configured to support the die pad and the lead part. The lead frame material includes a resin sealing region 9. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer 12A formed by laminating a Ni plated layer 13 and a Pd plated layer 14 in this order or a three-layer plated layer 12B formed by laminating the Ni plated layer 13, the Pd plated layer 14 and an Au plated layer 15 in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件20包括具有管芯焊盘3的引线框架材料1，与半导体芯片30电连接的引线部分6和被配置为支撑管芯焊盘和引线部分的外框架2。 引线框架材料包括树脂密封区域9.在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm或更大的粗化面10A至10C和11A至11C。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层13和Pd镀层14而形成的双层镀层12A，或通过层压Ni镀层13，Pd镀层14和镀Au的三层镀层12B 层15以此顺序形成在引线框架材料的整个表面上。

公开(公告)号：US08742554B2

公开(公告)日：2014-06-03

申请号：US11912163

申请日：2006-04-26

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US20090039486A1

公开(公告)日：2009-02-12

申请号：US11912163

申请日：2006-04-26

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L23/495 ,  H05K3/10 ,  H05K3/30

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

摘要翻译： 电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有 在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入 密封树脂，其具有暴露的引线部分的下侧。

公开(公告)号：US08739401B2

公开(公告)日：2014-06-03

申请号：US12878137

申请日：2010-09-09

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H05K3/10

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3142 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05647 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

公开(公告)号：US08420446B2

公开(公告)日：2013-04-16

申请号：US13012268

申请日：2011-01-24

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L21/58

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件包括具有管芯焊盘的引线框架材料，与半导体芯片电连接的引线部分和被配置为支撑管芯焊盘和引线部分的外部框架。 引线框架材料包括树脂密封区域。 在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm以上的粗糙面。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层和Pd镀层而形成的双层镀层，或者依次层叠Ni镀层，Pd镀层和Au镀层而形成的三层镀层 在引线框架材料的整个表面上。

公开(公告)号：US20110117704A1

公开(公告)日：2011-05-19

申请号：US13012268

申请日：2011-01-24

申请人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

发明人： Yo Shimazaki ,  Hiroyuki Saito ,  Masachika Masuda ,  Kenji Matsumura ,  Masaru Fukuchi ,  Takao Ikezawa

IPC分类号： H01L21/58

CPC分类号： H01L23/49548 ,  C25D5/12 ,  H01L23/3142 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.

摘要翻译： 电路构件包括具有管芯焊盘的引线框架材料，与半导体芯片电连接的引线部分和被配置为支撑管芯焊盘和引线部分的外部框架。 引线框架材料包括树脂密封区域。 在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm以上的粗化面10A〜10C和11A〜11C。 除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。 依次层叠Ni镀层和Pd镀层而形成的双层镀层，或者依次层叠Ni镀层，Pd镀层和Au镀层而形成的三层镀层 在引线框架材料的整个表面上。

公开(公告)号：US06441502B2

公开(公告)日：2002-08-27

申请号：US09746842

申请日：2000-12-23

申请人： Junichi Yamada ,  Hideki Sato ,  Kunihiro Tsubosaki ,  Yo Shimazaki

发明人： Junichi Yamada ,  Hideki Sato ,  Kunihiro Tsubosaki ,  Yo Shimazaki

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A member for mounting of semiconductor is comprised of a substrate, a concave portions for electrode and a concave portion for wire formed on one surface of the substrate, electrode terminals formed in the concave portions for electrode, and a wire formed in the concave portion for wire, in which the concave portions for electrode terminals are formed deeper than the concave portions for wire. In the pattern-forming process, resist pattern having an opening for wire and openings for electrode in which a width of the openings for electrode is larger than a width of the portion for wire is formed on one surface of a substrate. In the etching process, a substrate is half-cut by etching a substrate through the resist pattern as a mask so that concave portions for electrode and a opening for wire are formed on the surface of the substrate. In the plating process, the substrate is plated through the same resist pattern as a mask to form electrode terminals in the concave portions for electrode and a wire in the concave portion for wire. In the peeling process, the resist pattern is removed off from the substrate, so that a member for mounting of semiconductor can be obtained.

摘要翻译： 用于安装半导体的部件包括基板，用于电极的凹部和形成在基板的一个表面上的线的凹部，形成在电极用凹部中的电极端子和形成在凹部中的线， 线，其中用于电极端子的凹部形成为比线的凹部更深。 在图案形成处理中，在基板的一个表面上形成具有用于电线的开口的电极的开口和用于电极的开口的宽度大于线的宽度的电极的开口的抗蚀剂图案。 在蚀刻工艺中，通过蚀刻通过抗蚀剂图案的衬底作为掩模来将衬底半切割，使得在衬底的表面上形成用于电极的凹部和线的开口。 在电镀处理中，通过与掩模相同的抗蚀剂图案对基板进行电镀，以在电极用凹部和电线用凹部中形成电极端子。 在剥离处理中，将抗蚀剂图案从基板上除去，从而可以获得用于安装半导体的部件。