Invention Application
- Patent Title: Method of manufacturing printed circuit board
- Patent Title (中): 制造印刷电路板的方法
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Application No.: US12453616Application Date: 2009-05-15
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Publication No.: US20090223044A1Publication Date: 2009-09-10
- Inventor: Han Seo Cho , Je Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
- Applicant: Han Seo Cho , Je Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0079003 20060821
- Main IPC: H05K3/10
- IPC: H05K3/10

Abstract:
A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
Public/Granted literature
- US07697800B2 Method of manufacturing printed circuit board Public/Granted day:2010-04-13
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