发明申请
- 专利标题: Method of manufacturing printed circuit board
- 专利标题(中): 制造印刷电路板的方法
-
申请号: US12453616申请日: 2009-05-15
-
公开(公告)号: US20090223044A1公开(公告)日: 2009-09-10
- 发明人: Han Seo Cho , Je Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
- 申请人: Han Seo Cho , Je Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2006-0079003 20060821
- 主分类号: H05K3/10
- IPC分类号: H05K3/10
摘要:
A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
公开/授权文献
- US07697800B2 Method of manufacturing printed circuit board 公开/授权日:2010-04-13
信息查询