发明申请
- 专利标题: LID FOR MICRO-ELECTRO-MECHANICAL DEVICE AND METHOD FOR FABRICATING THE SAME
- 专利标题(中): 用于微电子机械装置的盖子及其制造方法
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申请号: US12604907申请日: 2009-10-23
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公开(公告)号: US20100108345A1公开(公告)日: 2010-05-06
- 发明人: Shih-Ping Hsu , Kun-Chen Tsai , Micallaef Ivan
- 申请人: Shih-Ping Hsu , Kun-Chen Tsai , Micallaef Ivan
- 申请人地址: TW Taoyuan
- 专利权人: UNIMICRON TECHNOLOGY CORPORATION
- 当前专利权人: UNIMICRON TECHNOLOGY CORPORATION
- 当前专利权人地址: TW Taoyuan
- 优先权: TW097141729 20081030
- 主分类号: H05K5/00
- IPC分类号: H05K5/00 ; H05K13/00 ; B05D5/12
摘要:
A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess. Hence, the shielding effect upon the micro-electro-mechanical device is enhanced.
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