发明申请
US20100181684A1 RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE
失效
树脂组合物,填充材料,绝缘层和半导体器件
- 专利标题: RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE
- 专利标题(中): 树脂组合物,填充材料,绝缘层和半导体器件
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申请号: US12664003申请日: 2008-06-11
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公开(公告)号: US20100181684A1公开(公告)日: 2010-07-22
- 发明人: Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
- 申请人: Toyosei Takahashi , Rie Takayama , Hirohisa Dejima , Junya Kusunoki
- 申请人地址: JP Tokyo
- 专利权人: Sumitomo Bakelite Company Limited
- 当前专利权人: Sumitomo Bakelite Company Limited
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-155707 20070612; JP2008-108509 20080418
- 国际申请: PCT/JP2008/060713 WO 20080611
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; C08L1/00 ; C08L75/00 ; C08L67/00 ; B32B3/10
摘要:
A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.