公开(公告)号：US07999354B2

公开(公告)日：2011-08-16

申请号：US12664003

申请日：2008-06-11

申请人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

发明人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

IPC分类号： H01L29/40

CPC分类号： C08L63/10 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  Y10T428/24273 ,  H01L2924/014

摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

摘要翻译： 本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。 树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。 本发明的填充材料由上述树脂组合物的固化物形成。 本发明的绝缘层由上述树脂组合物的固化物形成。 绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。 本发明的半导体器件包括上述绝缘层。

公开(公告)号：US20100181684A1

公开(公告)日：2010-07-22

申请号：US12664003

申请日：2008-06-11

申请人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

发明人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

IPC分类号： H01L23/48 ,  C08L1/00 ,  C08L75/00 ,  C08L67/00 ,  B32B3/10

CPC分类号： C08L63/10 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  Y10T428/24273 ,  H01L2924/014

摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

摘要翻译： 本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。 树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。 本发明的填充材料由上述树脂组合物的固化物形成。 本发明的绝缘层由上述树脂组合物的固化物形成。 绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。 本发明的半导体器件包括上述绝缘层。

公开(公告)号：US08268540B2

公开(公告)日：2012-09-18

申请号：US11886262

申请日：2007-05-30

申请人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

发明人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

IPC分类号： G03F7/20

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.

摘要翻译： 制造光接收装置1的方法包括：在透明基板13上设置含有光固化树脂的树脂层14，其中多个透明基板部分13A被一体化，使得树脂层覆盖透明基板13; 选择性地照射树脂层14，然后进行显影处理，使得树脂层14保留在透明基板13的围绕部分对应于透明基板部分13A中的光接收部分11的区域的区域中; 将透明基板13分割为透明基板部13A的单位，得到多个透明基板部13A; 将基底基板12分割为基底部分12A的单元，从而获得多个基底部分12A; 并且经由树脂层14与基板部分12A和透明基板部分13A接合。

公开(公告)号：US20090226848A1

公开(公告)日：2009-09-10

申请号：US11886262

申请日：2007-05-30

申请人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

发明人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

IPC分类号： G03F7/20 ,  B32B38/10 ,  B32B37/12 ,  H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.

摘要翻译： 制造光接收装置1的方法包括：在透明基板13上设置含有光固化树脂的树脂层14，其中多个透明基板部分13A被一体化，使得树脂层覆盖透明基板13; 选择性地照射树脂层14，然后进行显影处理，使得树脂层14保留在透明基板13的围绕部分对应于透明基板部分13A中的光接收部分11的区域的区域中; 将透明基板13分割为透明基板部13A的单位，得到多个透明基板部13A; 将基底基板12分割为基底部分12A的单元，从而获得多个基底部分12A; 并且经由树脂层14与基板部分12A和透明基板部分13A接合。

公开(公告)号：US20100164126A1

公开(公告)日：2010-07-01

申请号：US12601642

申请日：2008-05-23

申请人： Toyosei Takahashi ,  Rie Takayama

发明人： Toyosei Takahashi ,  Rie Takayama

IPC分类号： H01L23/31 ,  C08K3/00

CPC分类号： G03F7/0047 ,  G03F7/032 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a resin composition. The resin composition is used for a resin spacer provided in a semiconductor device. The semiconductor device comprises of a substrate, a semiconductor element mounted on an interposer so as to face the substrate, and the resin spacer provided between the substrate and the interposer or the semiconductor element for bonding them together in a state that a space is formed between the substrate and the semiconductor element. The resin composition comprises an alkali solubility resin, a photopolimerization resin, and a particulate filler. An average particle size of the particulate filler is in the range of 0.05 to 0.35 μm. An amount of the particulate filler contained in the resin composition is in the range of 1 to 40 wt %. Further, the present invention also provides a resin spacer film. The resin spacer film is constituted of the resin composition described above.

摘要翻译： 本发明提供一种树脂组合物。 树脂组合物用于设置在半导体器件中的树脂间隔物。 该半导体器件包括基板，安装在插入件上以面对基板的半导体元件，以及设置在基板和插入件之间的树脂隔板或半导体元件，用于将它们接合在一起， 基板和半导体元件。 树脂组合物包含碱溶性树脂，光聚合树脂和颗粒填料。 粒状填料的平均粒径为0.05〜0.35μm。 树脂组合物中所含的颗粒状填料的量在1〜40重量％的范围内。 此外，本发明还提供一种树脂间隔膜。 树脂隔离膜由上述树脂组合物构成。

公开(公告)号：US08034651B2

公开(公告)日：2011-10-11

申请号：US12668341

申请日：2008-02-19

申请人： Toyosei Takahashi ,  Rie Takayama ,  Mitsuo Sugino ,  Masakazu Kawata

发明人： Toyosei Takahashi ,  Rie Takayama ,  Mitsuo Sugino ,  Masakazu Kawata

IPC分类号： H01L21/00 ,  H01L21/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light receiving device 1 includes a support substrate 12 provided thereon with a photodetector 11 including a photodetecting portion 111 and a base substrate 112 on which the photodetecting portion 111 is placed; and a transparent substrate 13 disposed so as to oppose the face of the support substrate 12 on which the photodetector 11 is provided. Between the support substrate 12 and the transparent substrate 13, a frame portion 14 is provided so as to surround the photodetector 11. The frame portion 14 is a photo-curing adhesive, and directly adhered to the transparent substrate 13 and the support substrate 12. Such structure provides a light receiving device capable of exhibiting the desired performance, and a method of manufacturing such light receiving device can also be provided.

摘要翻译： 光接收装置1包括设置有光电检测器11的支撑基板12，该光检测器11包括受光部分111和放置有光电检测部分111的基板112; 以及设置成与设置有光电检测器11的支撑基板12的表面相对的透明基板13。 在支撑基板12和透明基板13之间设置有围绕光电检测器11的框架部分14.框架部分14是光固化粘合剂，并且直接粘附到透明基板13和支撑基板12上。 这种结构提供能够表现出期望性能的光接收装置，并且还可以提供制造这种光接收装置的方法。

公开(公告)号：US20100183983A1

公开(公告)日：2010-07-22

申请号：US12665175

申请日：2008-06-16

申请人： Rie Takayama ,  Toyosei Takahashi

发明人： Rie Takayama ,  Toyosei Takahashi

IPC分类号： G03F7/20

CPC分类号： H01L31/0203 ,  G03F9/708 ,  G03F9/7084 ,  H01L23/544 ,  H01L27/14627 ,  H01L27/14685 ,  H01L31/18 ,  H01L2223/54426 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process of this invention contains forming a resin composition containing a filler and a photocurable resin over a substrate (a transparent substrate 13) having a mark or an electronic component (a light receiving unit 11 and a base substrate 12 on which the light receiving unit 11 is formed) having a mark such that the resin composition covers the mark; aligning a mask in an exposure machine with the substrate on which the resin composition is formed or the electronic component on which the resin composition is formed; selectively exposing the resin composition with light via the mask and then the developing the resin composition for leaving the resin composition in a predetermined region; and disposing the substrate and the electronic component such that they face each other and bonding these via the resin composition. In aligning a mask in an exposure machine with the substrate on which the resin composition is formed or the electronic component on which the resin composition is formed, the mark is detected using a light with a wavelength of 1.5 times or more of an average particle size of the filler in the resin composition.

摘要翻译： 本发明的方法包括在具有标记或电子部件的基板（透明基板13）上形成含有填料和光固化性树脂的树脂组合物（受光单元11和基板12，光接收单元 11）形成，其具有使树脂组合物覆盖标记的标记; 将曝光机中的掩模与其上形成树脂组合物的基材或形成有树脂组合物的电子部件对准; 通过掩模选择性地将树脂组合物曝光，然后将树脂组合物显影出预定区域; 并且将基板和电子部件配置成使得它们彼此面对并通过树脂组合物粘合它们。 在曝光机中与形成有树脂组合物的基板或其上形成有树脂组合物的电子部件对准掩模时，使用波长为平均粒径的1.5倍以上的光来检测标记 的树脂组合物中的填料。

公开(公告)号：US20100297439A1

公开(公告)日：2010-11-25

申请号：US12599685

申请日：2008-05-27

申请人： Rie Takayama ,  Toyosei Takahashi

发明人： Rie Takayama ,  Toyosei Takahashi

IPC分类号： G03F7/004 ,  B32B7/12 ,  B32B27/00

CPC分类号： G03F7/0388 ,  C08L63/00 ,  C08L2666/22 ,  C09J4/00 ,  C09J7/35 ,  C09J163/00 ,  C09J163/10 ,  C09J2205/31 ,  C09J2461/00 ,  G03F7/027 ,  G03F7/40 ,  Y10T428/2809 ,  Y10T428/31935 ,  C08F220/30

摘要： A photosensitive adhesive resin composition includes (A) a compound having a hydroxyl group or a carboxyl group, and a (meth)acryloyl group, (B) a resin which cures with the compound (A) by thermal treatment, (C) a compound having a (meth)acryloyl group and not having a hydroxyl group and a carboxyl group, (D) a phenol resin or a phenol compound, and (E) a photoactive compound. The photosensitive adhesive resin composition has excellent developability, and is used for producing a spacer formed between a transparent substrate and a substrate on which a semiconductor element is formed. An adhesive film and a light-receiving device are produced using the photosensitive adhesive resin composition.

摘要翻译： 感光性粘合剂树脂组合物包含（A）具有羟基或羧基的化合物和（甲基）丙烯酰基，（B）通过热处理与化合物（A）固化的树脂，（C）化合物 具有（甲基）丙烯酰基且不具有羟基和羧基的化合物，（D）酚醛树脂或酚化合物，和（E）光活性化合物。 感光性粘合剂树脂组合物具有优异的显影性，并且用于制造在透明基板和形成有半导体元件的基板之间形成的间隔物。 使用该感光性粘接性树脂组合物制造粘合膜和受光装置。

公开(公告)号：US20100258713A1

公开(公告)日：2010-10-14

申请号：US12668341

申请日：2008-02-19

申请人： Toyosei Takahashi ,  Rie Takayama ,  Mitsuo Sugino ,  Masakazu Kawata

发明人： Toyosei Takahashi ,  Rie Takayama ,  Mitsuo Sugino ,  Masakazu Kawata

IPC分类号： H01L31/0203 ,  B32B38/10 ,  H01L31/09

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light receiving device 1 includes a support substrate 12 provided thereon with a photodetector 11 including a photodetecting portion 111 and a base substrate 112 on which the photodetecting portion 111 is placed; and a transparent substrate 13 disposed so as to oppose the face of the support substrate 12 on which the photodetector 11 is provided. Between the support substrate 12 and the transparent substrate 13, a frame portion 14 is provided so as to surround the photodetector 11. The frame portion 14 is a photo-curing adhesive, and directly adhered to the transparent substrate 13 and the support substrate 12. Such structure provides a light receiving device capable of exhibiting the desired performance, and a method of manufacturing such light receiving device can also be provided.

摘要翻译： 光接收装置1包括设置有光电检测器11的支撑基板12，该光检测器11包括受光部分111和放置有光电检测部分111的基板112; 以及设置成与设置有光电检测器11的支撑基板12的表面相对的透明基板13。 在支撑基板12和透明基板13之间设置有围绕光电检测器11的框架部分14.框架部分14是光固化粘合剂，并且直接粘附到透明基板13和支撑基板12上。 这种结构提供能够表现出期望性能的光接收装置，并且还可以提供制造这种光接收装置的方法。

公开(公告)号：US20100193122A1

公开(公告)日：2010-08-05

申请号：US12665130

申请日：2008-06-16

申请人： Toyosei Takahashi ,  Rie Takayama

发明人： Toyosei Takahashi ,  Rie Takayama

IPC分类号： B29C65/14

CPC分类号： H01L31/18 ,  H01L24/94 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102

摘要： There is provided a process for manufacturing an electronic device, comprising an electronic component (a light receiving unit 11 and a base substrate 12 on which is placed the light receiving unit 11) and a substrate (a transparent substrate 13) which face each other and an adhesion layer 15, which bonds the electronic component to the substrate, containing a resin composition containing a photocurable resin, comprising forming the resin composition constituting the adhesion layer on the substrate or the electronic component; selectively exposing the resin composition with a light and developing the resin composition to form the frame-shaped adhesion layer in a predetermined region; placing the adhesion layer between the electronic component and the substrate; heating the electronic component, the substrate and the adhesion layer to a predetermined temperature, in the course of which the electronic component and the substrate are pressure-bonded through the adhesion layer; maintaining the pressure-bonding state of the electronic component, the substrate and the adhesion layer at the predetermined temperature; and cooling the electronic component, the substrate and the adhesion layer.

摘要翻译： 提供了一种用于制造电子设备的方法，包括电子部件（光接收单元11和其上放置有光接收单元11的基板12）和彼此面对的基板（透明基板13） 将包含含有光固化性树脂的树脂组合物的电子部件与基板接合的粘合层15，其包括在基板或电子部件上形成构成粘合层的树脂组合物; 选择性地曝光树脂组合物并显影树脂组合物以在预定区域形成框状粘合层; 将粘合层放置在电子部件和基板之间; 将电子部件，基板和粘合层加热至预定温度，电子部件和基板通过粘合层进行压力粘合; 将电子部件，基板和粘合层的压接状态维持在预定温度; 并冷却电子部件，基板和粘附层。