公开(公告)号：US07999354B2

公开(公告)日：2011-08-16

申请号：US12664003

申请日：2008-06-11

申请人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

发明人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

IPC分类号： H01L29/40

CPC分类号： C08L63/10 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  Y10T428/24273 ,  H01L2924/014

摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

摘要翻译： 本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。 树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。 本发明的填充材料由上述树脂组合物的固化物形成。 本发明的绝缘层由上述树脂组合物的固化物形成。 绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。 本发明的半导体器件包括上述绝缘层。

公开(公告)号：US20100181684A1

公开(公告)日：2010-07-22

申请号：US12664003

申请日：2008-06-11

申请人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

发明人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

IPC分类号： H01L23/48 ,  C08L1/00 ,  C08L75/00 ,  C08L67/00 ,  B32B3/10

CPC分类号： C08L63/10 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  Y10T428/24273 ,  H01L2924/014

摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

摘要翻译： 本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。 树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。 本发明的填充材料由上述树脂组合物的固化物形成。 本发明的绝缘层由上述树脂组合物的固化物形成。 绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。 本发明的半导体器件包括上述绝缘层。

公开(公告)号：US08268540B2

公开(公告)日：2012-09-18

申请号：US11886262

申请日：2007-05-30

申请人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

发明人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

IPC分类号： G03F7/20

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.

摘要翻译： 制造光接收装置1的方法包括：在透明基板13上设置含有光固化树脂的树脂层14，其中多个透明基板部分13A被一体化，使得树脂层覆盖透明基板13; 选择性地照射树脂层14，然后进行显影处理，使得树脂层14保留在透明基板13的围绕部分对应于透明基板部分13A中的光接收部分11的区域的区域中; 将透明基板13分割为透明基板部13A的单位，得到多个透明基板部13A; 将基底基板12分割为基底部分12A的单元，从而获得多个基底部分12A; 并且经由树脂层14与基板部分12A和透明基板部分13A接合。

公开(公告)号：US20090226848A1

公开(公告)日：2009-09-10

申请号：US11886262

申请日：2007-05-30

申请人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

发明人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

IPC分类号： G03F7/20 ,  B32B38/10 ,  B32B37/12 ,  H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.

摘要翻译： 制造光接收装置1的方法包括：在透明基板13上设置含有光固化树脂的树脂层14，其中多个透明基板部分13A被一体化，使得树脂层覆盖透明基板13; 选择性地照射树脂层14，然后进行显影处理，使得树脂层14保留在透明基板13的围绕部分对应于透明基板部分13A中的光接收部分11的区域的区域中; 将透明基板13分割为透明基板部13A的单位，得到多个透明基板部13A; 将基底基板12分割为基底部分12A的单元，从而获得多个基底部分12A; 并且经由树脂层14与基板部分12A和透明基板部分13A接合。

公开(公告)号：US08030425B2

公开(公告)日：2011-10-04

申请号：US12327611

申请日：2008-12-03

申请人： Christopher Apanius ,  Matthew Apanius ,  Edmund Elce ,  Hendra Ng ,  Brian Knapp ,  Takashi Hirano ,  Junya Kusunoki ,  Robert Shick

发明人： Christopher Apanius ,  Matthew Apanius ,  Edmund Elce ,  Hendra Ng ,  Brian Knapp ,  Takashi Hirano ,  Junya Kusunoki ,  Robert Shick

IPC分类号： C08F10/00 ,  C08F36/00 ,  C08G59/00

CPC分类号： C08G59/3218 ,  C08G59/24 ,  C08G61/02 ,  C08G61/06 ,  C08L63/00 ,  G03F7/0382

摘要： Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: wherein each of X, m, R1, R2, R3, and R4 is as defined herein and wherein a first type of repeat unit is derived from a glycidyl ether substituted norbornene monomer and a second type of repeat unit is derived from an aralkyl substituted norbornene monomer.

摘要翻译： 提供乙烯基加成聚合物组合物，形成这种组合物的方法，使用这种组合物形成微电子和光电子器件的方法。 由这种组合物包含的乙烯基加成聚合物具有聚合物主链，其具有两种或更多种不同类型的衍生自独立地选自式I的单体的降冰片烯型单体的重复单元：其中X，m，R 1，R 2，R 3和R 4中的每一个 如本文所定义，并且其中第一类型的重复单元衍生自缩水甘油醚取代的降冰片烯单体，第二类型的重复单元衍生自芳烷基取代的降冰片烯单体。

公开(公告)号：US20080277805A1

公开(公告)日：2008-11-13

申请号：US11663924

申请日：2005-09-29

申请人： Junya Kusunoki ,  Takashi Hirano

发明人： Junya Kusunoki ,  Takashi Hirano

IPC分类号： H01L23/29

CPC分类号： H01L23/3114 ,  C08G59/3218 ,  H01L23/293 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like.

摘要翻译： 公开了一种具有晶片级封装结构的半导体器件，其特征在于包含由在250℃以下可固化的树脂组合物构成的树脂层。 具有晶片级封装结构的这种半导体器件的低应力性，耐溶剂性，低吸水性，电绝缘性，粘合性等优异。

公开(公告)号：US09399725B2

公开(公告)日：2016-07-26

申请号：US13126999

申请日：2010-06-15

申请人： Etsu Takeuchi ,  Junya Kusunoki ,  Hiromichi Sugiyama ,  Toshiharu Kuboyama ,  Masakazu Kawata

发明人： Etsu Takeuchi ,  Junya Kusunoki ,  Hiromichi Sugiyama ,  Toshiharu Kuboyama ,  Masakazu Kawata

IPC分类号： H01L21/31 ,  H01L21/469 ,  C09J169/00 ,  C09D177/00 ,  C09D179/08 ,  H01L21/683

CPC分类号： C09J169/00 ,  C09D177/00 ,  C09D179/08 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

摘要： To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this.A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

摘要翻译： 为了提供一种用于半导体晶片的临时粘合剂，其减少对半导体晶片的损伤，使其易于拆卸，并且可以缩短热分解所需的时间，并且使用该半导体器件的制造方法。 一种用于半导体晶片的暂时粘结粘合剂，其是用于将半导体晶片临时接合到支撑基板上以便处理半导体晶片的临时粘合粘合剂，并且用于通过加工后的加热将半导体晶片从支撑基板上分离， 通过活性能量射线照射后50％重量损失温度降低的树脂组合物。

公开(公告)号：US20110318938A1

公开(公告)日：2011-12-29

申请号：US13126999

申请日：2010-06-15

申请人： Etsu Takeuchi ,  Junya Kusunoki ,  Hiromichi Sugiyama ,  Toshiharu Kuboyama ,  Masakazu Kawata

发明人： Etsu Takeuchi ,  Junya Kusunoki ,  Hiromichi Sugiyama ,  Toshiharu Kuboyama ,  Masakazu Kawata

IPC分类号： C09J169/00 ,  C08J3/28 ,  H01L21/302

CPC分类号： C09J169/00 ,  C09D177/00 ,  C09D179/08 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

摘要： To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

摘要翻译： 为了提供一种用于半导体晶片的临时粘合剂，其减少对半导体晶片的损伤，使其易于拆卸，并且可以缩短热分解所需的时间，并且使用该半导体器件的制造方法。 一种用于半导体晶片的暂时粘结粘合剂，其是用于将半导体晶片临时接合到支撑基板上以便处理半导体晶片的临时粘合粘合剂，并且用于通过加工后的加热将半导体晶片从支撑基板上分离， 通过活性能量射线照射后50％重量减少温度降低的树脂组合物组合物。

公开(公告)号：US07915467B2

公开(公告)日：2011-03-29

申请号：US11665543

申请日：2005-10-20

申请人： Junya Kusunoki ,  Takashi Hirano

发明人： Junya Kusunoki ,  Takashi Hirano

IPC分类号： C07C1/00

CPC分类号： C08G59/3218 ,  G03F7/0382 ,  H01L23/293 ,  H01L23/3171 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a semiconductor wafer which is characterized in that a resin layer composed of a resin composition containing a cyclic olefin resin (A) having an epoxy group and a photoacid generator (B) is arranged on a surface on which a circuit element is formed, and the residual stress of the resin layer after curing is 1-20 MPa. Also disclosed is a semiconductor device comprising such a semiconductor wafer.

摘要翻译： 公开了一种半导体晶片，其特征在于，在其上形成有电路元件的表面上设置由包含环氧基的环烯烃树脂（A）和光酸产生剂（B）的树脂组合物构成的树脂层， 固化后树脂层的残余应力为1-20MPa。 还公开了包括这种半导体晶片的半导体器件。

公开(公告)号：US20090189277A1

公开(公告)日：2009-07-30

申请号：US12327611

申请日：2008-12-03

申请人： Christopher Apanius ,  Matthew Apanius ,  Edmund Elce ,  Hendra Ng ,  Brian Knapp ,  Takashi Hirano ,  Junya Kusunoki ,  Robert A. Shick

发明人： Christopher Apanius ,  Matthew Apanius ,  Edmund Elce ,  Hendra Ng ,  Brian Knapp ,  Takashi Hirano ,  Junya Kusunoki ,  Robert A. Shick

IPC分类号： H01L23/06 ,  C08F132/08 ,  B05D3/06 ,  G03F7/004

CPC分类号： C08G59/3218 ,  C08G59/24 ,  C08G61/02 ,  C08G61/06 ,  C08L63/00 ,  G03F7/0382

摘要： Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: wherein each of X, m, R1, R2, R3, and R4 is as defined herein and wherein a first type of repeat unit is derived from a glycidyl ether substituted norbornene monomer and a second type of repeat unit is derived from an aralkyl substituted norbornene monomer.

摘要翻译： 提供乙烯基加成聚合物组合物，形成这种组合物的方法，使用这种组合物形成微电子和光电子器件的方法。 由这种组合物包含的乙烯基加成聚合物具有聚合物主链，其具有两种或更多种不同类型的衍生自独立地选自式I的单体的降冰片烯型单体的重复单元：其中X，m，R 1，R 2，R 3和R 4中的每一个 如本文所定义，并且其中第一类型的重复单元衍生自缩水甘油醚取代的降冰片烯单体，第二类型的重复单元衍生自芳烷基取代的降冰片烯单体。