发明申请
- 专利标题： SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME
- 专利标题（中）： 具有半导体夹具的半导体部件及其制造方法
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申请号： US10598143申请日： 2005-02-09
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公开(公告)号： US20100207277A1公开(公告)日： 2010-08-19
- 发明人: Michael Bauer , Thomas Engling , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
- 申请人： Michael Bauer , Thomas Engling , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
- 申请人地址： DE Munich
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Munich
- 优先权： DE102004008135.2 20040218
- 国际申请： PCT/DE2005/000215 WO 20050209
- 主分类号： H01L25/11
- IPC分类号： H01L25/11 ; H01L21/50
摘要：
A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.
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