Invention Application
- Patent Title: SOLID-STATE IMAGING DEVICE AND METHOD FOR PRODUCING THE SAME
- Patent Title (中): 固态成像装置及其制造方法
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Application No.: US12842583Application Date: 2010-07-23
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Publication No.: US20110024858A1Publication Date: 2011-02-03
- Inventor: Ikuo Yoshihara , Masaya Nagata , Naoto Sasaki , Taku Umebayashi , Hiroshi Takahashi , Yoichi Otsuka , Isaya Kitamura , Tokihisa Kaneguchi , Keishi Inoue , Toshihiko Hayashi , Hiroyasu Matsugai , Masayoshi Aonuma , Hiroshi Yoshioka
- Applicant: Ikuo Yoshihara , Masaya Nagata , Naoto Sasaki , Taku Umebayashi , Hiroshi Takahashi , Yoichi Otsuka , Isaya Kitamura , Tokihisa Kaneguchi , Keishi Inoue , Toshihiko Hayashi , Hiroyasu Matsugai , Masayoshi Aonuma , Hiroshi Yoshioka
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JPP2009-177562 20090730
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L31/02 ; H01L31/18
Abstract:
A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate.
Public/Granted literature
- US08410569B2 Solid-state imaging device and method for producing the same Public/Granted day:2013-04-02
Information query
IPC分类:
