发明申请
- 专利标题: LASER PROCESSING APPARATUS
- 专利标题(中): 激光加工设备
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申请号: US12899757申请日: 2010-10-07
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公开(公告)号: US20110084050A1公开(公告)日: 2011-04-14
- 发明人: Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
- 申请人: Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
- 申请人地址: JP Tokyo
- 专利权人: DISCO CORPORATION
- 当前专利权人: DISCO CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-235539 20091009
- 主分类号: B23K26/06
- IPC分类号: B23K26/06 ; B23K26/00
摘要:
A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.
公开/授权文献
- US08404999B2 Laser processing apparatus 公开/授权日:2013-03-26
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