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公开(公告)号：US20110084050A1
公开(公告)日：2011-04-14
申请号：US12899757
申请日：2010-10-07
申请人： Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
发明人： Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
CPC分类号： B23K26/0853 , B23K26/0673 , C03B33/0222
摘要： A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.
摘要翻译： 一种激光加工设备，包括激光施加单元。 激光施加单元包括第一激光振荡单元，第二激光振荡单元，用于将从第一激光振荡单元振荡的激光束分支为三个光路的第一激光分支单元，用于分支激光束振荡的第二激光分支单元 从第二激光振荡单元到三个光路中，三个第一聚焦单元，用于分别将激光束通过由第一激光分支单元获得的三个光路聚焦到玻璃基板，以及三个第二聚焦单元，用于分别聚焦激光束 由第二激光分支单元获得的三个光路。 第一聚焦单元和第二聚焦单元沿分度方向交替布置成一行。
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公开(公告)号：US08404999B2
公开(公告)日：2013-03-26
申请号：US12899757
申请日：2010-10-07
申请人： Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
发明人： Ken Togashi , Keiji Nomaru , Hiroshi Morikazu
IPC分类号： B23K26/38 , B23K26/067
CPC分类号： B23K26/0853 , B23K26/0673 , C03B33/0222
摘要： A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.
摘要翻译： 一种激光加工设备，包括激光施加单元。 激光施加单元包括第一激光振荡单元，第二激光振荡单元，用于将从第一激光振荡单元振荡的激光束分支为三个光路的第一激光分支单元，用于分支激光束振荡的第二激光分支单元 从第二激光振荡单元到三个光路中，三个第一聚焦单元，用于分别将激光束通过由第一激光分支单元获得的三个光路聚焦到玻璃基板，以及三个第二聚焦单元，用于分别聚焦激光束 由第二激光分支单元获得的三个光路。 第一聚焦单元和第二聚焦单元沿分度方向交替布置成一行。
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公开(公告)号：US08513566B2
公开(公告)日：2013-08-20
申请号：US11979936
申请日：2007-11-09
申请人： Hiroshi Morikazu , Keiji Nomaru
发明人： Hiroshi Morikazu , Keiji Nomaru
CPC分类号： B23K26/0853 , B23K26/067 , B23K26/0673 , B23K26/082 , B23K2101/40
摘要： A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table and a processing-feed means, wherein the laser beam application means comprises a first pulse laser beam application means and a second pulse laser beam application means; the first pulse laser beam application means comprises an acousto-optic deflection means for deflecting the optical axis of a pulse laser beam oscillated by a first pulse laser beam oscillation means in the processing-feed direction (X direction), and a first condenser lens for converging a pulse laser beam passing through the acousto-optic deflection means; the second pulse laser beam application means comprises a second condenser lens for converging a pulse laser beam oscillated by the second pulse laser beam oscillation means; and an NA value of the first condenser lens is set smaller than the NA value of the second condenser lens.
摘要翻译： 一种激光束处理机，包括：激光束施加装置，用于将激光束施加到夹持在卡盘台上的工件;以及加工进给装置，其中所述激光束施加装置包括第一脉冲激光束施加装置和第二脉冲激光器 射束施加装置; 第一脉冲激光束施加装置包括用于使由第一脉冲激光束振荡装置在处理进给方向（X方向）上振荡的脉冲激光束的光轴偏转的声光偏转装置，以及用于 会聚通过声光偏转装置的脉冲激光束; 第二脉冲激光束施加装置包括用于会聚由第二脉冲激光束振荡装置振荡的脉冲激光束的第二聚光透镜; 并且将第一聚光透镜的NA值设定为小于第二聚光透镜的NA值。
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公开(公告)号：US20070138156A1
公开(公告)日：2007-06-21
申请号：US11635539
申请日：2006-12-08
申请人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
发明人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
IPC分类号： B23K26/06
CPC分类号： B23K26/0869 , B23K26/082 , B23K26/0853 , B23K2101/40
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction).
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置 （X轴方向）彼此相对移动夹具台和激光束施加机构的分度供给机构，使其相对于彼此垂直的分度方向（Y轴方向）相对移动 到处理供给方向（X轴方向），其中激光束施加装置包括用于振荡激光束的激光振荡装置，用于偏转激光振荡的激光束的光轴的第一声光偏转装置 光束振荡意味着处理进给方向（X轴方向），以及用于偏转由激光束振荡振荡的激光束的光轴的第二声光偏转装置 意味着分度进给方向（Y轴方向）。
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公开(公告)号：US20060201920A1
公开(公告)日：2006-09-14
申请号：US11369945
申请日：2006-03-08
IPC分类号： B23K26/08
CPC分类号： B23K37/0235 , B23K26/0622 , B23K26/0853 , B23K26/0876 , B23K26/40 , B23K37/0408 , B23K37/0435 , B23K2103/172 , B23K2103/50
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y) perpendicular to the processing-feed direction (X), wherein the machine further comprises a processing-feed amount detection means for detecting a processing-feed amount; an indexing-feed amount detection means for detecting an indexing-feed amount; and a control means, which has a storage means for storing the X and Y coordinate values of a minute hole to be formed in the workpiece, and controls the laser beam application means based on the X and Y coordinate values of the minute hole stored in the storage means and detection signals from the processing-feed amount detection means and the indexing-feed amount detection means.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置 以及分度供给装置，用于使卡盘台和激光束施加装置相对于垂直于加工供给方向的分度方向（Y）相对移动， （X），其中所述机器还包括用于检测加工进给量的加工进给量检测装置; 用于检测分度供给量的分度供给量检测单元; 以及控制装置，其具有用于存储要在工件中形成的微孔的X和Y坐标值的存储装置，并且基于存储在所述微孔的X和Y坐标值来控制激光束施加装置 存储装置和来自处理供给量检测装置和分度供给量检测装置的检测信号。
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公开(公告)号：US09193008B2
公开(公告)日：2015-11-24
申请号：US13473824
申请日：2012-05-17
申请人： Hiroshi Morikazu , Keiji Nomaru , Yoko Nishino
发明人： Hiroshi Morikazu , Keiji Nomaru , Yoko Nishino
IPC分类号： B23K26/00 , B23K26/06 , B23K26/02 , H01L21/00 , B23K26/08 , B23K26/36 , B23K26/40 , B23K26/30 , H01L33/00
CPC分类号： B23K26/3584 , B23K26/0613 , B23K26/0622 , B23K26/064 , B23K26/0648 , B23K26/0853 , B23K26/36 , B23K26/364 , B23K26/40 , B23K26/402 , B23K26/60 , B23K2101/40 , B23K2103/50 , H01L33/0095
摘要： A laser processing method of applying a pulsed laser beam to a workpiece formed from a transparent member, thereby performing laser processing to the workpiece. The laser processing method includes a first laser processing step of applying a first pulsed laser beam to a subject area of the workpiece to roughen the subject area and a second laser processing step of applying a second pulsed laser beam to the roughened subject area immediately after performing the first laser processing step, thereby forming a recess in the subject area. The first and second laser processing steps are repeated to thereby form a continuous groove in the subject area.
摘要翻译： 一种将脉冲激光束施加到由透明构件形成的工件上的激光加工方法，从而对工件进行激光加工。 激光加工方法包括：第一激光加工步骤，将第一脉冲激光束施加到工件的被摄体区域以粗糙化被摄体区域;以及第二激光加工步骤，在执行后立即将粗糙化的被摄体区域施加第二脉冲激光束 第一激光加工步骤，从而在主体区域中形成凹部。 重复第一和第二激光加工步骤，从而在主体区域中形成连续的凹槽。
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公开(公告)号：US20080245779A1
公开(公告)日：2008-10-09
申请号：US12048616
申请日：2008-03-14
申请人： Keiji Nomaru , Hiroshi Morikazu , Taiki Sawabe
发明人： Keiji Nomaru , Hiroshi Morikazu , Taiki Sawabe
IPC分类号： B23K26/06
CPC分类号： B23K26/0736 , B23K26/082 , B23K2101/40
摘要： A laser processing machine that includes a chuck table adapted to hold a workpiece thereon and laser beam irradiation unit for applying a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes: a laser beam oscillation section for emitting a pulse laser beam; a defection section for deflecting the pulse laser beam emitted from the laser beam oscillation section; and a concentrator having an ellipsoidal focusing spot forming section for focusing the pulse laser beam deflected by the deflection unit and forming a focusing spot into an ellipse.
摘要翻译： 一种激光加工机，其特征在于，包括适于将工件保持在其上的卡盘台和用于将激光束施加到夹持在卡盘台上的工件的激光束照射单元。 激光束照射单元包括：激光束振荡部，用于发射脉冲激光束; 偏转部，用于偏转从激光束振荡部发射的脉冲激光束; 以及聚光器，其具有用于聚焦由偏转单元偏转的脉冲激光束并形成聚焦点的椭圆形聚焦点形成部。
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公开(公告)号：US20080053971A1
公开(公告)日：2008-03-06
申请号：US11895821
申请日：2007-08-28
申请人： Yutaka Kobayashi , Keiji Nomaru , Hiroshi Morikazu
发明人： Yutaka Kobayashi , Keiji Nomaru , Hiroshi Morikazu
IPC分类号： B23K26/00
CPC分类号： H01L21/76898 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/0853 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A via hole machining method for forming via holes, reaching bonding pads, in a wafer having a plurality of devices which are formed on a face side of a substrate and are provided with the bonding pads, by irradiation with a pulsed laser beam from a back side of the substrate, wherein the energy density per pulse of the pulsed laser beam is set at such a value that ablation of the substrate will occur but ablation of the bonding pad will not occur, and the time interval of pulses of the pulsed laser beam is set at a value of not less than 150 microseconds.
摘要翻译： 一种通孔加工方法，用于在具有多个器件的晶片中形成通孔，到达焊盘，该晶片形成在衬底的正面，并且设置有接合焊盘，通过从背面照射脉冲激光束 其中脉冲激光束的每个脉冲的能量密度被设定为这样的值，即衬底的烧蚀将不会发生，而焊接垫的烧蚀将不会发生，脉冲激光束的脉冲的时间间隔 被设定为不小于150微秒的值。
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公开(公告)号：US07589332B2
公开(公告)日：2009-09-15
申请号：US11900844
申请日：2007-09-13
申请人： Keiji Nomaru , Hiroshi Morikazu
发明人： Keiji Nomaru , Hiroshi Morikazu
CPC分类号： H01L21/76898 , B23K26/0622 , B23K26/382 , B23K26/40 , B23K2103/50 , H01L2924/0002 , H01L2924/00
摘要： In a via-hole formation method of forming a via-hole reaching a bonding pad, in a substrate of a wafer in which a plurality of devices are formed on a surface of the substrate and the bonding pad is formed on each of the devices, a pulse laser beam whose energy distribution is shaped into a top-hat shape is emitted to form a via-hole reaching a via-hole.
摘要翻译： 在形成到达焊盘的通孔的通孔形成方法中，在基板的表面上形成有多个器件的晶片的基板和在每个器件上形成接合焊盘的通孔形成方法中， 发射其能量分布形成顶帽形状的脉冲激光束，以形成到达通孔的通孔。
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公开(公告)号：US08779325B2
公开(公告)日：2014-07-15
申请号：US12073271
申请日：2008-03-03
申请人： Keiji Nomaru , Yutaka Kobayashi , Hiroshi Morikazu
发明人： Keiji Nomaru , Yutaka Kobayashi , Hiroshi Morikazu
CPC分类号： B23K26/355 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/06 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser beam processing machine includes a laser beam application device and a controller. The controller controls deflecting of the optical axis of a pulse laser beam from the laser beam application device in the processing-feed direction according to a plurality of processing position coordinates, and according to the frequency of the beam, to ensure that there is a predetermined time interval between pulses applied to the same processing position coordinates. One pulse is applied at a time to each of the plurality of processing position coordinates.
摘要翻译： 激光束处理机包括激光束施加装置和控制器。 控制器根据多个处理位置坐标以及根据光束的频率来控制来自激光束施加装置的激光束施加装置的脉冲激光束的光轴的偏转，以确保存在预定的 施加到相同处理位置坐标的脉冲之间的时间间隔。 一次施加一个脉冲到多个处理位置坐标中的每一个。
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