公开(公告)号：US20110084050A1

公开(公告)日：2011-04-14

申请号：US12899757

申请日：2010-10-07

申请人： Ken Togashi ,  Keiji Nomaru ,  Hiroshi Morikazu

发明人： Ken Togashi ,  Keiji Nomaru ,  Hiroshi Morikazu

IPC分类号： B23K26/06 ,  B23K26/00

CPC分类号： B23K26/0853 ,  B23K26/0673 ,  C03B33/0222

摘要： A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.

摘要翻译： 一种激光加工设备，包括激光施加单元。 激光施加单元包括第一激光振荡单元，第二激光振荡单元，用于将从第一激光振荡单元振荡的激光束分支为三个光路的第一激光分支单元，用于分支激光束振荡的第二激光分支单元 从第二激光振荡单元到三个光路中，三个第一聚焦单元，用于分别将激光束通过由第一激光分支单元获得的三个光路聚焦到玻璃基板，以及三个第二聚焦单元，用于分别聚焦激光束 由第二激光分支单元获得的三个光路。 第一聚焦单元和第二聚焦单元沿分度方向交替布置成一行。

公开(公告)号：US08404999B2

公开(公告)日：2013-03-26

申请号：US12899757

申请日：2010-10-07

申请人： Ken Togashi ,  Keiji Nomaru ,  Hiroshi Morikazu

发明人： Ken Togashi ,  Keiji Nomaru ,  Hiroshi Morikazu

IPC分类号： B23K26/38 ,  B23K26/067

CPC分类号： B23K26/0853 ,  B23K26/0673 ,  C03B33/0222

摘要： A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into three optical paths, a second laser branching unit for branching a laser beam oscillated from the second laser oscillating unit into three optical paths, three first focusing units for respectively focusing the laser beams through the three optical paths obtained by the first laser branching unit toward a glass substrate, and three second focusing units for respectively focusing the laser beams through the three optical paths obtained by the second laser branching unit. The first focusing units and the second focusing units are alternately arranged in a line in an indexing direction.

摘要翻译： 一种激光加工设备，包括激光施加单元。 激光施加单元包括第一激光振荡单元，第二激光振荡单元，用于将从第一激光振荡单元振荡的激光束分支为三个光路的第一激光分支单元，用于分支激光束振荡的第二激光分支单元 从第二激光振荡单元到三个光路中，三个第一聚焦单元，用于分别将激光束通过由第一激光分支单元获得的三个光路聚焦到玻璃基板，以及三个第二聚焦单元，用于分别聚焦激光束 由第二激光分支单元获得的三个光路。 第一聚焦单元和第二聚焦单元沿分度方向交替布置成一行。

公开(公告)号：US08513566B2

公开(公告)日：2013-08-20

申请号：US11979936

申请日：2007-11-09

申请人： Hiroshi Morikazu ,  Keiji Nomaru

发明人： Hiroshi Morikazu ,  Keiji Nomaru

IPC分类号： B23K26/02 ,  B23K26/38

CPC分类号： B23K26/0853 ,  B23K26/067 ,  B23K26/0673 ,  B23K26/082 ,  B23K2101/40

摘要： A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table and a processing-feed means, wherein the laser beam application means comprises a first pulse laser beam application means and a second pulse laser beam application means; the first pulse laser beam application means comprises an acousto-optic deflection means for deflecting the optical axis of a pulse laser beam oscillated by a first pulse laser beam oscillation means in the processing-feed direction (X direction), and a first condenser lens for converging a pulse laser beam passing through the acousto-optic deflection means; the second pulse laser beam application means comprises a second condenser lens for converging a pulse laser beam oscillated by the second pulse laser beam oscillation means; and an NA value of the first condenser lens is set smaller than the NA value of the second condenser lens.

摘要翻译： 一种激光束处理机，包括：激光束施加装置，用于将激光束施加到夹持在卡盘台上的工件;以及加工进给装置，其中所述激光束施加装置包括第一脉冲激光束施加装置和第二脉冲激光器 射束施加装置; 第一脉冲激光束施加装置包括用于使由第一脉冲激光束振荡装置在处理进给方向（X方向）上振荡的脉冲激光束的光轴偏转的声光偏转装置，以及用于 会聚通过声光偏转装置的脉冲激光束; 第二脉冲激光束施加装置包括用于会聚由第二脉冲激光束振荡装置振荡的脉冲激光束的第二聚光透镜; 并且将第一聚光透镜的NA值设定为小于第二聚光透镜的NA值。

公开(公告)号：US20070138156A1

公开(公告)日：2007-06-21

申请号：US11635539

申请日：2006-12-08

申请人： Keiji Nomaru ,  Yasuomi Kaneuchi ,  Hiroshi Morikazu

发明人： Keiji Nomaru ,  Yasuomi Kaneuchi ,  Hiroshi Morikazu

IPC分类号： B23K26/06

CPC分类号： B23K26/0869 ,  B23K26/082 ,  B23K26/0853 ,  B23K2101/40

摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction).

摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置 （X轴方向）彼此相对移动夹具台和激光束施加机构的分度供给机构，使其相对于彼此垂直的分度方向（Y轴方向）相对移动 到处理供给方向（X轴方向），其中激光束施加装置包括用于振荡激光束的激光振荡装置，用于偏转激光振荡的激光束的光轴的第一声光偏转装置 光束振荡意味着处理进给方向（X轴方向），以及用于偏转由激光束振荡振荡的激光束的光轴的第二声光偏转装置 意味着分度进给方向（Y轴方向）。

公开(公告)号：US20060201920A1

公开(公告)日：2006-09-14

申请号：US11369945

申请日：2006-03-08

申请人： Hiroshi Morikazu ,  Keiji Nomaru ,  Katsuharu Negishi

发明人： Hiroshi Morikazu ,  Keiji Nomaru ,  Katsuharu Negishi

IPC分类号： B23K26/08

CPC分类号： B23K37/0235 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/40 ,  B23K37/0408 ,  B23K37/0435 ,  B23K2103/172 ,  B23K2103/50

摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y) perpendicular to the processing-feed direction (X), wherein the machine further comprises a processing-feed amount detection means for detecting a processing-feed amount; an indexing-feed amount detection means for detecting an indexing-feed amount; and a control means, which has a storage means for storing the X and Y coordinate values of a minute hole to be formed in the workpiece, and controls the laser beam application means based on the X and Y coordinate values of the minute hole stored in the storage means and detection signals from the processing-feed amount detection means and the indexing-feed amount detection means.

摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置 以及分度供给装置，用于使卡盘台和激光束施加装置相对于垂直于加工供给方向的分度方向（Y）相对移动， （X），其中所述机器还包括用于检测加工进给量的加工进给量检测装置; 用于检测分度供给量的分度供给量检测单元; 以及控制装置，其具有用于存储要在工件中形成的微孔的X和Y坐标值的存储装置，并且基于存储在所述微孔的X和Y坐标值来控制激光束施加装置 存储装置和来自处理供给量检测装置和分度供给量检测装置的检测信号。

公开(公告)号：US07589332B2

公开(公告)日：2009-09-15

申请号：US11900844

申请日：2007-09-13

申请人： Keiji Nomaru ,  Hiroshi Morikazu

发明人： Keiji Nomaru ,  Hiroshi Morikazu

IPC分类号： G21G5/00 ,  B23K26/38

CPC分类号： H01L21/76898 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a via-hole formation method of forming a via-hole reaching a bonding pad, in a substrate of a wafer in which a plurality of devices are formed on a surface of the substrate and the bonding pad is formed on each of the devices, a pulse laser beam whose energy distribution is shaped into a top-hat shape is emitted to form a via-hole reaching a via-hole.

摘要翻译： 在形成到达焊盘的通孔的通孔形成方法中，在基板的表面上形成有多个器件的晶片的基板和在每个器件上形成接合焊盘的通孔形成方法中， 发射其能量分布形成顶帽形状的脉冲激光束，以形成到达通孔的通孔。

公开(公告)号：US08779325B2

公开(公告)日：2014-07-15

申请号：US12073271

申请日：2008-03-03

申请人： Keiji Nomaru ,  Yutaka Kobayashi ,  Hiroshi Morikazu

发明人： Keiji Nomaru ,  Yutaka Kobayashi ,  Hiroshi Morikazu

IPC分类号： B23K26/02 ,  B23K26/00

CPC分类号： B23K26/355 ,  B23K26/032 ,  B23K26/034 ,  B23K26/04 ,  B23K26/06 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

摘要： A laser beam processing machine includes a laser beam application device and a controller. The controller controls deflecting of the optical axis of a pulse laser beam from the laser beam application device in the processing-feed direction according to a plurality of processing position coordinates, and according to the frequency of the beam, to ensure that there is a predetermined time interval between pulses applied to the same processing position coordinates. One pulse is applied at a time to each of the plurality of processing position coordinates.

摘要翻译： 激光束处理机包括激光束施加装置和控制器。 控制器根据多个处理位置坐标以及根据光束的频率来控制来自激光束施加装置的激光束施加装置的脉冲激光束的光轴的偏转，以确保存在预定的 施加到相同处理位置坐标的脉冲之间的时间间隔。 一次施加一个脉冲到多个处理位置坐标中的每一个。

公开(公告)号：US07932478B2

公开(公告)日：2011-04-26

申请号：US12048616

申请日：2008-03-14

申请人： Keiji Nomaru ,  Hiroshi Morikazu ,  Taiki Sawabe

发明人： Keiji Nomaru ,  Hiroshi Morikazu ,  Taiki Sawabe

IPC分类号： B23K26/06 ,  B23K26/36

CPC分类号： B23K26/0736 ,  B23K26/082 ,  B23K2101/40

摘要： A laser processing machine that includes a chuck table adapted to hold a workpiece thereon and laser beam irradiation unit for applying a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes: a laser beam oscillation section for emitting a pulse laser beam; a defection section for deflecting the pulse laser beam emitted from the laser beam oscillation section; and a concentrator having an ellipsoidal focusing spot forming section for focusing the pulse laser beam deflected by the deflection unit and forming a focusing spot into an ellipse.

摘要翻译： 一种激光加工机，其特征在于，包括适于将工件保持在其上的卡盘台和用于将激光束施加到夹持在卡盘台上的工件的激光束照射单元。 激光束照射单元包括：激光束振荡部，用于发射脉冲激光束; 偏转部，用于偏转从激光束振荡部发射的脉冲激光束; 以及聚光器，其具有用于聚焦由偏转单元偏转的脉冲激光束并形成聚焦点的椭圆形聚焦点形成部。

公开(公告)号：US07675002B2

公开(公告)日：2010-03-09

申请号：US11635539

申请日：2006-12-08

申请人： Keiji Nomaru ,  Yasuomi Kaneuchi ,  Hiroshi Morikazu

发明人： Keiji Nomaru ,  Yasuomi Kaneuchi ,  Hiroshi Morikazu

IPC分类号： B23K26/38 ,  B23K26/067

CPC分类号： B23K26/0869 ,  B23K26/082 ,  B23K26/0853 ,  B23K2101/40

摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application device for applying a laser beam to the workpiece held on the chuck table, a processing-feed device for moving the chuck table and the laser beam application device relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed device for moving the chuck table and the laser beam application device relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application device includes a laser oscillation device for oscillating a laser beam, a first acousto-optic deflection device for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation device in the processing-feed direction (X-axis direction), and a second acousto-optic deflection device for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation device in the indexing-feed direction (Y-axis direction).

摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到夹持在夹盘上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置 （X轴方向）彼此相对移动夹具台和激光束施加装置的分度供给装置，使其相对于彼此垂直的分度方向（Y轴方向）移动 到处理供给方向（X轴方向），其中激光束施加装置包括用于振荡激光束的激光振荡装置，用于偏转由激光振荡的激光束的光轴的第一声光偏转装置 处理进给方向（X轴方向）的光束振荡装置，以及用于偏转由激光束振荡的激光束的光轴的第二声光偏转装置 （Y轴方向）上的错误装置。

公开(公告)号：US07471384B2

公开(公告)日：2008-12-30

申请号：US11896336

申请日：2007-08-31

申请人： Keiji Nomaru ,  Hiroshi Morikazu ,  Yasuomi Kaneuchi ,  Kouichi Nehashi ,  Yutaka Kobayashi

发明人： Keiji Nomaru ,  Hiroshi Morikazu ,  Yasuomi Kaneuchi ,  Kouichi Nehashi ,  Yutaka Kobayashi

IPC分类号： G01N21/00

CPC分类号： G01B11/22 ,  B23K26/03 ,  B23K26/034 ,  B23K26/0643 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50

摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.

摘要翻译： 一种通孔深度检测器，用于检测形成在保持在卡盘台上的工件中的通孔的深度，包括：第一表面位置检测装置，包括第一检测激光束振荡装置，用于振荡具有预定 基于第一检测激光束的反射光检测被照射部分的高度位置; 第二表面位置检测装置，其包括用于振荡具有与第一检测激光束的波长不同的波长的第二检测激光束的第二检测激光束振荡装置，并且基于该第二检测激光束振荡装置检测工件的被照射部分的高度位置 第二检测激光束的反射光; 以及控制装置，用于基于由第一表面位置检测装置获得的检测值和由第二表面位置检测装置获得的检测值来获得形成在工件中的通孔的深度。