发明申请
- 专利标题： TEMPERATURE MEASUREMENT AND CONTROL OF WAFER SUPPORT IN THERMAL PROCESSING CHAMBER
- 专利标题（中）： 温度测量和控制热处理室中的支撑
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申请号： US12973112申请日： 2010-12-20
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公开(公告)号： US20110089166A1公开(公告)日： 2011-04-21
- 发明人: AARON MUIR HUNTER , Bruce E. Adams , Mehran Behdjat , Rajesh S. Ramanujam , Joseph M. Ranish
- 申请人： AARON MUIR HUNTER , Bruce E. Adams , Mehran Behdjat , Rajesh S. Ramanujam , Joseph M. Ranish
- 主分类号： H05B6/02
- IPC分类号： H05B6/02 ; F27D11/12 ; H05B6/64 ; B23K26/12
摘要：
The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.